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Multi-dimentional Analyses
Company Valuation Capital Tracking Short Selling Data
AMKR Amkor Technology
20.510
-1.850-8.27%
YOY
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(Q2)2022/06/30(Q1)2022/03/31(FY)2021/12/31(Q4)2021/12/31
Total revenue
6.99% 1.5B 20.41% 1.6B 21.54% 6.14B 25.79% 1.72B
Operating revenue
6.99% 1.5B 20.41% 1.6B 21.54% 6.14B 25.79% 1.72B
Cost of revenue
10.76% 1.26B 19.88% 1.27B 18.39% 4.91B 24.69% 1.36B
Gross profit
-8.67% 249.16M 22.52% 325.33M 36.05% 1.23B 30.11% 362.37M
Operating expense
-9.65% 106.35M -4.76% 115.32M 4.18% 462.12M -7.85% 109.96M
Selling and administrative expenses
-7.17% 68.87M 0.25% 76.96M -2.23% 296.08M -7.25% 72.55M
Research and development costs
-13.88% 37.48M -13.44% 38.36M 17.99% 166.04M -8.98% 37.41M
Operating profit
-7.93% 142.81M 45.39% 210.01M 66.96% 763.43M 58.57% 252.41M
Net non-operating interest income expense
-0.94% -12.65M -9.29% -13.55M 14.09% -50.44M 10.42% -13.18M
Non-operating interest income
743.91% 1.94M 116.13% 603K -80.46% 1.07M -- --
Non-operating interest expense
14.33% 14.59M 11.64% 14.15M -19.73% 51.51M -10.42% 13.18M
Other net income (expense)
4652.24% 6.1M 1320.92% 4.49M 117.53% 2.08M 154.54% 2.63M
Gain on sale of security
1018.36% 6.25M 794.83% 4.3M 92.48% -723K -- --
Special income (charges)
-- -367K -- -97K -- 0 -- --
-Less:Other special charges
-- 367K -- 97K -- -- -- --
Other non- operating income (expenses)
-61.06% 213K 15.14% 289K 247.27% 2.8M 154.54% 2.63M
Income before tax
-4.35% 136.26M 52.6% 200.96M 84.92% 715.07M 73.2% 241.87M
Income tax
-32.53% 10.79M 154.8% 29.73M 50.4% 69.46M 93.9% 24.58M
Net income
-0.78% 125.47M 42.67% 171.23M 89.61% 645.61M 71.14% 217.28M
Net income continuous Operations
-0.78% 125.47M 42.67% 171.23M 89.61% 645.61M 71.14% 217.28M
Minority interest income
5.98% 691K 169.05% 565K 10.63% 2.61M 160.14% 757K
Net income attributable to the parent company
-0.82% 124.78M 42.45% 170.66M 90.16% 643M 70.93% 216.53M
Preferred stock dividends
Other preferred stock dividends
Net income attributable to common stockholders
-0.82% 124.78M 42.45% 170.66M 90.16% 643M 70.93% 216.53M
Basic earnings per share
-1.92% 0.51 42.86% 0.7 88.57% 2.64 71.15% 0.89
Diluted earnings per share
0% 0.51 40.82% 0.69 87.14% 2.62 69.23% 0.88
Dividend per share
25% 0.05 25% 0.05 325% 0.17 25% 0.05
Currency Unit
USDUSDUSDUSD
Accounting Standards
US-GAAPUS-GAAPUS-GAAPUS-GAAP
Audit Opinions
----Unqualified Opinion--

FY: Financial Year Annual Report, which is equivalent to the 10-K file disclosed by the listed company to the SEC.

Q: Quarterly report, which is equivalent to the 10-Q file disclosed by the listed company to the SEC, where Q1, Q2, Q3, and Q4 are single quarterly reports with a span of 3 months; Q6 and Q9 are cumulative quarterly reports, and Q6 is 6 months , Q9 is 9 months.

The MOM data from the Quarterly report,MOM=(current period - last period)/last period *100%

Company Overview More
Amkor Technology, Inc. provides outsourced semiconductor packaging and test services in the United States, Japan, Europe, the Middle East, Africa, and the rest of the Asia Pacific. It offers turnkey packaging and test services, including semiconductor wafer bump, wafer probe, wafer back-grind, package design, packaging, and test and drop shipment services. The company also provides flip chip-scale package products for use in smartphones, tablets, and other mobile consumer electronic devices; flip-chip stacked chip-scale packages that are used to stack memory on top of digital baseband, and as applications processors in mobile devices; and flip-chip ball grid array packages for various networking, storage, computing, and consumer applications. In addition, it offers wafer-level CSP packages that are used in power management, transceivers, sensors, wireless charging, codecs, radar, and specialty silicon; wafer-level fan-out packages for use in ICs; and silicon wafer integrated fan-out technology, which replaces a laminate substrate with a thinner structure. Further, the company provides lead frame packages that are used in electronic devices for low to medium pin count analog and mixed-signal applications; substrate-based wirebond packages, which are used to connect a die to a substrate; micro-electro-mechanical systems (MEMS) packages that are miniaturized mechanical and electromechanical devices; and advanced system-in-package modules, which are used in radio frequency and front end modules, basebands, connectivity, fingerprint sensors, display and touch screen drivers, sensors and MEMS, and NAND memory and solid-state drives. It primarily serves integrated device manufacturers, fabless semiconductor companies, original equipment manufacturers, and contract foundries. Amkor Technology, Inc. was founded in 1968 and is headquartered in Tempe, Arizona.
CEO: --
Market: NASDAQ
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