ASMPT (00522) rose more than 5%. As of press release, it had risen 4.65% to HK$103.6, with a turnover of HK$128 million.
The Zhitong Finance App learned that ASMPT (00522) rose by more than 5%. As of press release, it had risen 4.65% to HK$103.6, with a turnover of HK$128 million.
According to media reports, SK Hynix is increasing its spending on advanced chip packaging, hoping to seize the opportunities brought by the growing market demand for high-bandwidth memory (HBM). Furthermore, according to industry sources, key participants in the International Semiconductor Standards Organization recently agreed to standard HBM4 products at 775 microns, which is 775 microns thicker than the previous generation of 720 microns. This means that 16-layer DRAM stacking HBM4 can be fully realized using existing bonding technology.
Morgan Stanley released a research report saying that the bank believes that the height relaxation of HBM4 products may increase the chances of 16-layer HBMs using hot pressure welding (TCB). The rating was “increased” by ASMPT and its 2026 earnings forecast per share was raised. It is expected that as the serviceable market for hot pressure welding expands in 2026 and beyond, the stock will be further evaluated. Assuming that ASMPT is the leader in the TCB industry, the target price was raised from HK$108 to HK$123.