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華虹半導體：海外監管公告 - 《2023年度業績快報公告》

HUA HONG SEMI: An announcement has just been published by the issuer in the Chinese section of this website, a corresponding version of which may or may not be published in this section

香港交易所 ·  Feb 23 05:37
Summary by Moomoo AI
華虹半導體有限公司於2023年度業績快報中公布，公司在報告期內實現營業收入1,623,187.40萬元，同比下降3.30%；營業利潤117,791.99萬元，同比大幅下降65.04%；利潤總額117,754.41萬元，同比下降64.75%。归属于母公司所有者的净利润為193,623.04萬元，同比下降35.64%，而扣除非經常性損益的净利润為161,402.82萬元，同比下降37.21%。基本每股收益從上年的2.31元降至1.31元，下降43.29%。報告期末，公司總資產增長至7,622,635.11萬元，同比增長59.21%；归属于母公司的所有者权益增至4,335,425.24萬元，同比增長...展開全部
華虹半導體有限公司於2023年度業績快報中公布，公司在報告期內實現營業收入1,623,187.40萬元，同比下降3.30%；營業利潤117,791.99萬元，同比大幅下降65.04%；利潤總額117,754.41萬元，同比下降64.75%。归属于母公司所有者的净利润為193,623.04萬元，同比下降35.64%，而扣除非經常性損益的净利润為161,402.82萬元，同比下降37.21%。基本每股收益從上年的2.31元降至1.31元，下降43.29%。報告期末，公司總資產增長至7,622,635.11萬元，同比增長59.21%；归属于母公司的所有者权益增至4,335,425.24萬元，同比增長118.47%。公司表示，全球半導體市場下滑、晶圓代工市場挑戰、需求疲軟、庫存高企及價格壓力是影響業績的主要因素。此外，公司平均銷售價格和產能利用率下降，以及產能擴充和新產品研發加速導致的折舊費用和研發費用上升，也是導致營業利潤、利潤總額和净利润下降的原因。本公司強調，公告所載財務數據為初步核算數據，未經會計師事務所審計，最終數據以2023年年度報告為準。
HUA HONG SEMICONDUCTOR CO., LTD. ANNOUNCED IN ITS 2023 ANNUAL RESULTS EXPRESS THAT THE COMPANY ACHIEVED OPERATING REVENUE OF $1,623,187,40 MILLION, DOWN 3.30% YEAR-ON-YEAR; OPERATING PROFIT 117,791.99 MILLION YUAN, A SIGNIFICANT DECREASE OF 65.04% YEAR-ON-YEAR; AND TOTAL PROFIT OF 117,754.41 MILLION YUAN, A DECREASE OF 64.75% YEAR-ON-YEAR. Net profit attributable to parent company owners was $193,623.04 million, down 35.64% year-on-year, while net profit excluding non-recurring loss was $161,402.82 million, down 37.21% year-on-year. Basic earnings per share fell to $1.31 from $2.31 a year earlier, down 43.29%. At the end of the reporting period, the total assets of the company increased to $7,622,635.11 million, an increase of 59.21% year-on-year; and the shareholders' equity attributable to the parent company increased to $4,335,425.24 million, an increase of...Show More
HUA HONG SEMICONDUCTOR CO., LTD. ANNOUNCED IN ITS 2023 ANNUAL RESULTS EXPRESS THAT THE COMPANY ACHIEVED OPERATING REVENUE OF $1,623,187,40 MILLION, DOWN 3.30% YEAR-ON-YEAR; OPERATING PROFIT 117,791.99 MILLION YUAN, A SIGNIFICANT DECREASE OF 65.04% YEAR-ON-YEAR; AND TOTAL PROFIT OF 117,754.41 MILLION YUAN, A DECREASE OF 64.75% YEAR-ON-YEAR. Net profit attributable to parent company owners was $193,623.04 million, down 35.64% year-on-year, while net profit excluding non-recurring loss was $161,402.82 million, down 37.21% year-on-year. Basic earnings per share fell to $1.31 from $2.31 a year earlier, down 43.29%. At the end of the reporting period, the total assets of the company increased to $7,622,635.11 million, an increase of 59.21% year-on-year; and the shareholders' equity attributable to the parent company increased to $4,335,425.24 million, an increase of 118.47% year-on-year. The company said the decline in the global semiconductor market, challenges in the wafers market, weak demand, high inventories and price pressures were the main factors impacting the results. In addition, the decrease in the company's average sales price and capacity utilization, as well as the increase in depreciation and R&D expenses due to capacity expansion and acceleration of new product R&D, also contributed to the decline in operating profit, total profit and net profit. THE COMPANY EMPHASIZES THAT THE FINANCIAL DATA PRESENTED IN THE ANNOUNCEMENT ARE PRELIMINARY AUDITED DATA AND ARE NOT AUDITED BY THE ACCOUNTING FIRM. THE FINAL DATA ARE BASED ON THE 2023 REPORT.

This announcement is a separate document:

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