Summary by Moomoo AI
Shanghai Fudan Microelectronics Group Co., Ltd. (“Shanghai Fudan”) plans to issue A-share convertible corporate bonds to an unspecified audience to raise funds for next-generation FPGA platform development and industrialization projects. The plan was approved by the Company's General Meeting on 5 July 2023 and is pending registration with the China Securities and Exchange Commission. The sponsor is Zhongxin Jiane Securities Co., Ltd. Referral representatives are Zhao Fengbin and Zhu Jin Chai. This issue of A-shares convertible corporate bonds is for a period of six years, with an issue size not exceeding RMB200 billion. The funds raised will be used for integrated circuit-related projects in line with national industry policies. CITIC Securities has conducted a thorough investigation of Shanghai Fudan to confirm that it complies with relevant legal and regulatory requirements and listing rules.