Nvidia's Evaluation Leads To Major Blow For Samsung's AI Chip Efforts: Heat And Power Consumption Issues Uncovered
Nvidia's Evaluation Leads To Major Blow For Samsung's AI Chip Efforts: Heat And Power Consumption Issues Uncovered
Samsung Electronics' latest high bandwidth memory (HBM) chips have reportedly failed the tests conducted by Nvidia (NASDAQ:NVDA) for use in its AI processors. The failure is attributed to issues related to heat and power consumption.
據報道，三星電子最新的高帶寬存儲器（HBM）芯片未通過英偉達（納斯達克股票代碼：NVDA）爲其人工智能處理器進行的測試。該故障歸因於與熱量和功耗相關的問題。
What Happened: The problems are linked to Samsung's HBM3 chips, which are extensively used in graphics processing units (GPUs) for artificial intelligence, Reuters reported on Friday. The upcoming fifth-generation HBM3E chips are also affected. This is the first time such issues have been reported.
發生了什麼：路透社週五報道，這些問題與三星的HBM3芯片有關，該芯片廣泛用於人工智能的圖形處理單元（GPU）。即將推出的第五代 HBM3E 芯片也受到影響。這是首次報告此類問題。
Nvidia, holding approximately 80% of the global GPU market for AI applications, is a significant customer for HBM manufacturers. Samsung has been striving to pass Nvidia's tests for HBM3 and HBM3E since last year.
英偉達擁有全球人工智能應用GPU市場約80％的份額，是HBM製造商的重要客戶。自去年以來，三星一直在努力通過英偉達對HBM3和 HBM3E 的測試。
The recent failures have sparked concerns among industry insiders and investors about Samsung's competitive stance against rivals SK Hynix and Micron Technology (NASDAQ:MU).
最近的失敗引發了業內人士和投資者對三星與競爭對手海力士和美光科技（納斯達克股票代碼：MU）的競爭立場的擔憂。
Why It Matters: The development comes on the heels of a speculation that AI could boost Samsung's stock performance, despite the challenges with HBM.
爲何重要：這一事態發展是在有人猜測儘管HBM面臨挑戰但人工智能仍可能提振三星股票表現之後發生的。
While Samsung faces these issues, SK Hynix continues to supply Nvidia with HBM chips. Micron has also pledged to provide Nvidia with HBM3E. Samsung's struggles have led to a leadership change in its semiconductor unit this week.
儘管三星面臨這些問題，但SK海力士繼續向Nvidia提供HBM芯片。美光還承諾向英偉達提供 HBM3E。三星的困境導致了本週其半導體部門的領導層變動。
Despite the setbacks, Samsung continues to supply other customers like Advanced Micro Devices and plans to commence mass production of HBM3E chips in the second quarter. In late April, Samsung announced its plans to mass-produce the groundbreaking 5th Gen HBM3E chip to advance AI innovation.
儘管遇到了挫折，但三星繼續爲先進微設備等其他客戶提供服務，並計劃在第二季度開始批量生產 HBM3E 芯片。4月下旬，三星宣佈計劃批量生產開創性的第五代 HBM3E 芯片，以推進人工智能創新。
Image via Shutterstock
圖片來自 Shutterstock
This story was generated using Benzinga Neuro and edited by Pooja Rajkumari
這個故事是使用 Benzinga Neuro 創作的，由 Pooja Rajkumari