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Taiwan Semiconductor | 6-K: Report of foreign private issuer [Rules 13a-16 and 15d-16]

Taiwan Semiconductor | 6-K: Report of foreign private issuer [Rules 13a-16 and 15d-16]

台积电 | 6-K:外国发行人报告
SEC announcement ·  02/06 07:56
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On February 6, 2024, Taiwan Semiconductor Manufacturing Company Ltd. (TSMC) conducted a Board of Directors meeting where several key resolutions were passed. The board approved the 2023 Business Report and Financial Statements, revealing a consolidated revenue of NT$2,161.74 billion and a net income of NT$838.50 billion, resulting in diluted earnings per share of NT$32.34. A cash dividend of NT$3.50 per share for the fourth quarter of 2023 was also approved, with a record date set for June 19, 2024, and payment due on July 11, 2024. The ex-dividend date for both common shares and American Depositary Shares (ADSs) is June 13, 2024. Additionally, the board sanctioned the distribution of approximately NT$100.18 billion as employees' business performance bonus and profit sharing for 2023. Significant capital appropriations were approved, including US$9.42 billion...Show More
On February 6, 2024, Taiwan Semiconductor Manufacturing Company Ltd. (TSMC) conducted a Board of Directors meeting where several key resolutions were passed. The board approved the 2023 Business Report and Financial Statements, revealing a consolidated revenue of NT$2,161.74 billion and a net income of NT$838.50 billion, resulting in diluted earnings per share of NT$32.34. A cash dividend of NT$3.50 per share for the fourth quarter of 2023 was also approved, with a record date set for June 19, 2024, and payment due on July 11, 2024. The ex-dividend date for both common shares and American Depositary Shares (ADSs) is June 13, 2024. Additionally, the board sanctioned the distribution of approximately NT$100.18 billion as employees' business performance bonus and profit sharing for 2023. Significant capital appropriations were approved, including US$9.42 billion for various technological and facility enhancements, and capital injections of US$5.26 billion to Japan Advanced Semiconductor Manufacturing, Inc. (JASM), US$5 billion to TSMC Arizona, and US$3 billion to TSMC Global Ltd. The board also approved the issuance of 2.96 million shares of 2023 employee restricted stock awards (RSAs) and proposed the issuance of up to 4.18 million common shares of RSAs for 2024, pending approval at the 2024 Annual Shareholders’ Meeting. The meeting also set the 2024 AGM for June 4, 2024, where elections for TSMC’s 10-member Board of Directors will take place. Personnel promotions included Wendell Huang to Senior Vice President and Sylvia Fang to Senior Vice President. TSMC, a leader in the semiconductor foundry industry since 1987, supports a global ecosystem with advanced process technologies and design solutions.
2024 年 2 月 6 日,台湾半导体制造股份有限公司(台积电)举行了董事会会议,通过了几项关键决议。董事会批准了2023年业务报告和财务报表,显示合并收入为新台币2,1617.4亿元,净收益为8385.0亿新台币,摊薄后每股收益为新台币32.34元。2023年第四季度每股3.50新台币的现金股息也获得批准,创纪录的日期定为2024年6月19日,派息将于2024年7月11日到期。普通股和美国存托股票(ADS)的除息日均为2024年6月13日。此外,董事会批准了约1001.8亿新台币的分配,作为2023年员工的经营业绩奖金和利润分成。大量资本拨款获得批准,包括94.2亿美元用于各种技术和设施改...展开全部
2024 年 2 月 6 日,台湾半导体制造股份有限公司(台积电)举行了董事会会议,通过了几项关键决议。董事会批准了2023年业务报告和财务报表,显示合并收入为新台币2,1617.4亿元,净收益为8385.0亿新台币,摊薄后每股收益为新台币32.34元。2023年第四季度每股3.50新台币的现金股息也获得批准,创纪录的日期定为2024年6月19日,派息将于2024年7月11日到期。普通股和美国存托股票(ADS)的除息日均为2024年6月13日。此外,董事会批准了约1001.8亿新台币的分配,作为2023年员工的经营业绩奖金和利润分成。大量资本拨款获得批准,包括94.2亿美元用于各种技术和设施改进,向日本先进半导体制造有限公司(JASM)注资52.6亿美元,向亚利桑那州台积电注资50亿美元,向台积电全球有限公司注资30亿美元。董事会还批准发行296万股2023年员工限制性股票奖励(RSA),并提议发行高达418万股普通股 2024年的注册服务协议,尚待2024年年度股东大会批准。会议还将2024年的股东周年大会定为2024年6月4日,届时将举行台积电由10名成员组成的董事会的选举。人事晋升包括黄文德晋升为高级副总裁和方希尔维亚晋升为高级副总裁。台积电自1987年以来一直是半导体代工行业的领导者,它通过先进的工艺技术和设计解决方案为全球生态系统提供支持。
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