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Taiwan Semiconductor Manufacturing Company Ltd. (TSMC), listed on the NYSE as TSM, filed a Form 6-K with the United States Securities and Exchange Commission for the month of March 2024, reporting several key financial activities for February 2024. The report, signed by Senior Vice President and Chief Financial Officer Wendell Huang on March 25, 2024, detailed changes in shareholdings by TSMC's board of directors, executive officers, and major shareholders, with minor adjustments in the number of shares held. Notably, Dr. Cliff Hou was appointed as Senior Vice President and Deputy Co-Chief Operating Officer effective March 1, 2024. The company also reported on its investment activities, with NT$23.1 billion in fixed-income acquisitions and NT$3.2 billion in equity dispositions. Additionally, TSMC's board of directors...Show More
Taiwan Semiconductor Manufacturing Company Ltd. (TSMC), listed on the NYSE as TSM, filed a Form 6-K with the United States Securities and Exchange Commission for the month of March 2024, reporting several key financial activities for February 2024. The report, signed by Senior Vice President and Chief Financial Officer Wendell Huang on March 25, 2024, detailed changes in shareholdings by TSMC's board of directors, executive officers, and major shareholders, with minor adjustments in the number of shares held. Notably, Dr. Cliff Hou was appointed as Senior Vice President and Deputy Co-Chief Operating Officer effective March 1, 2024. The company also reported on its investment activities, with NT$23.1 billion in fixed-income acquisitions and NT$3.2 billion in equity dispositions. Additionally, TSMC's board of directors approved significant capital appropriations, including US$6.3 billion for machinery equipment for advanced technology capacity, US$0.9 billion for advanced packaging, mature and/or specialty technology capacity, and US$2.2 billion for real estate and capitalized leased assets. No changes in the pledge of TSMC common shares or unsecured bonds issued were reported for the period.
在纽约证券交易所上市的名为TSM的台湾半导体制造股份有限公司（TSMC）向美国证券交易委员会提交了2024年3月的6-K表格，报告了2024年2月的几项关键财务活动。该报告由高级副总裁兼首席财务官黄文德于2024年3月25日签署，详细介绍了台积电董事会、执行官和主要股东的股权变化，对持股数量进行了细微调整。值得注意的是，Cliff Hou博士被任命为高级副总裁兼副联席首席运营官，自2024年3月1日起生效。该公司还报告了其投资活动，固定收益收购为新台币231亿元，股权处置为新台币32亿美元。此外，台积电董事会批准了大量资本拨款，包括63亿美元用于先进技术产能的机械设备，9亿美元用于先进封装、成熟和/或专业技术产能，22亿美元用于房地产和资本化租赁资产。在此期间，台积电普通股或发行的无抵押债券的质押没有变化。
在纽约证券交易所上市的名为TSM的台湾半导体制造股份有限公司（TSMC）向美国证券交易委员会提交了2024年3月的6-K表格，报告了2024年2月的几项关键财务活动。该报告由高级副总裁兼首席财务官黄文德于2024年3月25日签署，详细介绍了台积电董事会、执行官和主要股东的股权变化，对持股数量进行了细微调整。值得注意的是，Cliff Hou博士被任命为高级副总裁兼副联席首席运营官，自2024年3月1日起生效。该公司还报告了其投资活动，固定收益收购为新台币231亿元，股权处置为新台币32亿美元。此外，台积电董事会批准了大量资本拨款，包括63亿美元用于先进技术产能的机械设备，9亿美元用于先进封装、成熟和/或专业技术产能，22亿美元用于房地产和资本化租赁资产。在此期间，台积电普通股或发行的无抵押债券的质押没有变化。
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