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Taiwan Semiconductor | 6-K: Submission Period for 2024 Annual Shareholders`Meeting

Taiwan Semiconductor | 6-K: Report of foreign private issuer [Rules 13a-16 and 15d-16]

台积电 | 6-K:外国发行人报告
SEC announcement ·  03/18 06:13
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Taiwan Semiconductor Manufacturing Company Ltd. (TSM), also known as Taiwan Semiconductor, has filed a Form 6-K with the United States Securities and Exchange Commission (SEC) for the month of March 2024. The report, dated March 18, 2024, and signed by Senior Vice President and Chief Financial Officer Wendell Huang, indicates that the company will file annual reports under Form 20-F. Additionally, Taiwan Semiconductor has announced the submission period for proposed resolutions and director nominations for its 2024 Annual Shareholders' Meeting. The submission period for shareholders to propose resolutions and nominate director candidates, including seven independent directors out of ten to be elected, will commence on April 2, 2024, and conclude on April 9, 2024. Shareholders are instructed to contact Citibank Shareholder Services for any enquiries regarding the submission process.
Taiwan Semiconductor Manufacturing Company Ltd. (TSM), also known as Taiwan Semiconductor, has filed a Form 6-K with the United States Securities and Exchange Commission (SEC) for the month of March 2024. The report, dated March 18, 2024, and signed by Senior Vice President and Chief Financial Officer Wendell Huang, indicates that the company will file annual reports under Form 20-F. Additionally, Taiwan Semiconductor has announced the submission period for proposed resolutions and director nominations for its 2024 Annual Shareholders' Meeting. The submission period for shareholders to propose resolutions and nominate director candidates, including seven independent directors out of ten to be elected, will commence on April 2, 2024, and conclude on April 9, 2024. Shareholders are instructed to contact Citibank Shareholder Services for any enquiries regarding the submission process.
台湾半导体制造股份有限公司(TSM),也称为台湾半导体,已向美国证券交易委员会(SEC)提交了2024年3月的6-K表格。该报告日期为2024年3月18日,由高级副总裁兼首席财务官黄文德签署,表明该公司将根据20-F表格提交年度报告。此外,台湾半导体还宣布了其2024年年度股东大会的拟议决议和董事提名的提交期限。股东提出决议和提名候选董事的提交期限将从2024年4月2日开始,并于2024年4月9日结束,包括十名独立董事中的七名候选人。如果对提交流程有任何疑问,请股东联系花旗银行股东服务部。
台湾半导体制造股份有限公司(TSM),也称为台湾半导体,已向美国证券交易委员会(SEC)提交了2024年3月的6-K表格。该报告日期为2024年3月18日,由高级副总裁兼首席财务官黄文德签署,表明该公司将根据20-F表格提交年度报告。此外,台湾半导体还宣布了其2024年年度股东大会的拟议决议和董事提名的提交期限。股东提出决议和提名候选董事的提交期限将从2024年4月2日开始,并于2024年4月9日结束,包括十名独立董事中的七名候选人。如果对提交流程有任何疑问,请股东联系花旗银行股东服务部。
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