REVASUM (ASX:RVS) Announces the Release of a 200mm Conversion Kit for Their Flagship 6EZ Silicon Carbide (SiC) Chemical Mechanical Polishing (CMP) Platform
REVASUM (ASX:RVS) Announces the Release of a 200mm Conversion Kit for Their Flagship 6EZ Silicon Carbide (SiC) Chemical Mechanical Polishing (CMP) Platform
SAN LUIS OBISPO, Calif., July 6, 2023 /PRNewswire/ -- Revasum today announced the availability of 200mm SiC wafer polishing capability on the 6EZ platform. The 6EZ has already proven its value in high-volume manufacturing of 150mm SiC substrates and a 200mm conversion kit has now been fully tested and released, giving customers the option of upgrading 6EZ systems in the field.
加利福尼亚州圣路易斯奥比斯波，2023年7月6日/美通社/--Revasum今天宣布在6EZ平台上提供200 mm碳化硅晶片抛光能力。6EZ已经在150 mm碳化硅基板的大批量制造中证明了其价值，200 mm转换套件现已经过全面测试和发布，为客户提供了在现场升级6EZ系统的选择。
Dr. Fred Sun, Vice President of R&D and Process Technologies at Revasum said, "While the 6EZ was designed from the start to polish 200mm substrates, due to scarcity of these larger substrates in the market, we had not been able to fully characterize polishing performance on 200mm substrates until recently. The tool performed incredibly well on the 200mm wafers - we achieved the same PV (Pressure x Velocity) operating range that we had seen previously on 150mm SiC wafers, even with a doubling of the surface area under polish."
Dr。弗雷德·孙Revasum研发与工艺技术副总裁总裁说：“虽然6EZ从一开始就是为抛光200 mm基板而设计的，但由于市场上这些较大基板的稀缺性，我们直到最近才能够完全表征200 mm基板上的抛光性能。该工具在200 mm晶片上表现得令人难以置信地好--我们在150 mm碳化硅晶片上实现了相同的PV(压力x速度)工作范围，即使抛光下的表面积翻了一番。”
The 6EZ is the first single wafer CMP tool designed from the ground up for SiC wafer polishing. The 6EZ's architecture coupled with patented cooling technology allows for the higher downforce and table speeds preferred for CMP of hard materials like SiC. The proprietary ViPRR carrier design secures the wafer while minimizing polishing friction on the pad to allow for reduced pad conditioning, better wafer-to-wafer consistency and extended consumables life.
6EZ是第一个为碳化硅晶片抛光而设计的单晶片化学机械抛光工具。6EZ的结构与专利冷却技术相结合，可以提供更高的下压力和工作台速度，这是碳化硅等硬质材料化学机械抛光的首选。专有的ViPRR托架设计确保了晶片的安全，同时最大限度地减少了衬垫上的抛光摩擦，从而减少了衬垫的调节，改善了晶片到晶片的一致性，并延长了耗材的使用寿命。
Scott Jewler, CEO of Revasum said, "We believe that polishing prime SiC wafers requires a different approach to head design than the conventional membrane-based heads. The polishing head should hold the wafer in position while applying controlled pressure to the backside of the wafer to produce a uniform high removal rate with good thermal management. We are very pleased with the 200mm SiC wafer results achieved on the 6EZ and I believe our customers will also appreciate how easy the tool is to maintain in a high-volume production environment at this larger wafer size."
斯科特·朱勒Revasum首席执行官表示：“我们认为，抛光优质碳化硅晶片需要一种不同于传统薄膜基头的头部设计方法。抛光头应该将晶片保持在适当的位置，同时对晶片背面施加受控压力，以产生均匀的高去除率和良好的热管理。我们对6EZ上取得的200 mm碳化硅晶片的结果感到非常满意，我相信我们的客户也会意识到，在这种更大的晶片尺寸的大批量生产环境中，该工具是多么容易保持。”
About Revasum, Inc.:
Revasum specializes in the design and manufacturing of capital equipment used in the semiconductor substrate and device manufacturing process. Our current product portfolio includes the 7AF-HMG grinder and 6EZ CMP platform used to manufacture silicon carbide substrates up to 200mm and the packaging of SiC-based devices for the global semiconductor industry.
Revasum公司简介：
Revasum专门从事半导体基板和器件制造过程中使用的资本设备的设计和制造。我们目前的产品组合包括用于制造200 mm以下碳化硅衬底的7AF-HMG磨床和6EZ化学机械抛光平台，以及用于全球半导体行业的碳化硅基器件的封装。
CONTACT: Bruce Ray, [email protected]
联系方式：布鲁斯·雷，[受电子邮件保护]
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