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Moomoo > Quotes > AMKR Amkor Technology > Company Executives
AMKR Amkor Technology
Post Mkt Price
NamePositionSalaryService DateEducationAgeGenderUpdated
Mr. Guillaume Marie Jean RuttenPresident, Chief Executive Officer and Director3.83M----64male04/12/2022
Ms. Megan FaustExecutive Vice President, Chief Financial Officer, Treasurer and Principal Accounting Officer1.87M----48female04/12/2022
Mr. Mark N. RogersExecutive Vice President, General Counsel and Corporate Secretary1.71M----56male04/12/2022
Mr. Farshad HaghighiExecutive Vice President, Worldwide Sales1.07M----59male04/12/2022
Mr. Steve ShinExecutive Vice President, Worldwide Manufacturing------59male04/12/2022
Mr. James J. KimExecutive Chairman of the Board5.11M----86male04/12/2022
Ms. Susan Y. KimExecutive Vice Chairman of the Board425.78K----59female04/12/2022
Mr. Gil C. TilyDirector431.78K----68male04/12/2022
Mr. David N. WatsonIndependent Director346.78K----63male04/12/2022
Mr. Douglas A. AlexanderIndependent Director350.78K----60male04/12/2022
Mr. Roger A. CarolinIndependent Director383.78K----66male04/12/2022
Mr. Winston J. ChurchillLead Independent Director407.78K----81male04/12/2022
Mr. Robert R. MorseIndependent Director358.78K----66male04/12/2022
Ms. MaryFrances McCourtIndependent Director355.78K----60female04/12/2022
Mr. Daniel LiaoIndependent Director349.78K----68male04/12/2022
Company Overview More
Amkor Technology, Inc. provides outsourced semiconductor packaging and test services in the United States, Japan, Europe, the Middle East, Africa, and the rest of the Asia Pacific. It offers turnkey packaging and test services, including semiconductor wafer bump, wafer probe, wafer back-grind, package design, packaging, and test and drop shipment services. The company also provides flip chip-scale package products for use in smartphones, tablets, and other mobile consumer electronic devices; flip-chip stacked chip-scale packages that are used to stack memory on top of digital baseband, and as applications processors in mobile devices; and flip-chip ball grid array packages for various networking, storage, computing, and consumer applications. In addition, it offers wafer-level CSP packages that are used in power management, transceivers, sensors, wireless charging, codecs, radar, and specialty silicon; wafer-level fan-out packages for use in ICs; and silicon wafer integrated fan-out technology, which replaces a laminate substrate with a thinner structure. Further, the company provides lead frame packages that are used in electronic devices for low to medium pin count analog and mixed-signal applications; substrate-based wirebond packages, which are used to connect a die to a substrate; micro-electro-mechanical systems (MEMS) packages that are miniaturized mechanical and electromechanical devices; and advanced system-in-package modules, which are used in radio frequency and front end modules, basebands, connectivity, fingerprint sensors, display and touch screen drivers, sensors and MEMS, and NAND memory and solid-state drives. It primarily serves integrated device manufacturers, fabless semiconductor companies, original equipment manufacturers, and contract foundries. Amkor Technology, Inc. was founded in 1968 and is headquartered in Tempe, Arizona.
CEO: --
Market: NASDAQ
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