donwloadimg

Download App

Log in to access Online Inquiry
Multi-dimentional Analyses
Company Valuation Capital Tracking Short Selling Data
Moomoo > Quotes > AMKR Amkor Technology > Detailed Quotes

AMKR Amkor Technology

16.760
-0.470-2.73%
Close 06/29 16:00 ET
16.900
+0.14+0.83%
Post Mkt Price 06/29 17:09 ET
High
17.130
Open
17.030
Turnover
13.84M
Low
16.560
Pre Close
17.230
Volume
826.22K
Market Cap
4.10B
P/E(TTM)
5.94
52wk High
29.322
Shares
244.78M
P/E(Static)
6.40
52wk Low
16.260
Float Cap
1.13B
Bid/Ask %
-25.00%
Historical High
64.488
Shs Float
67.67M
Volume Ratio
0.88
Historical Low
1.067
Dividend TTM
0.18
Div Yield TTM
10000
P/B
1.33
Dividend LFY
1.07%
Div Yield LFY
59665.87%
Turnover Ratio
1.22%
Amplitude
3.31%
Avg Price
16.745
Lot Size
1
Float Cap
1.13B
Bid/Ask %
-25.00%
Historical High
64.488
Shs Float
67.67M
Volume Ratio
0.88
Historical Low
1.067
Dividend TTM
0.18
P/B
1.33
Dividend LFY
1.07%
Turnover Ratio
1.22%
Amplitude
3.31%
Avg Price
16.745
Lot Size
1
Price Forecast

No Data

News

Comment

Company Overview More
Amkor Technology, Inc. provides outsourced semiconductor packaging and test services in the United States, Japan, Europe, the Middle East, Africa, and the rest of the Asia Pacific. It offers turnkey packaging and test services, including semiconductor wafer bump, wafer probe, wafer back-grind, package design, packaging, and test and drop shipment services. The company also provides flip chip-scale package products for use in smartphones, tablets, and other mobile consumer electronic devices; flip-chip stacked chip-scale packages that are used to stack memory on top of digital baseband, and as applications processors in mobile devices; and flip-chip ball grid array packages for various networking, storage, computing, and consumer applications. In addition, it offers wafer-level CSP packages that are used in power management, transceivers, sensors, wireless charging, codecs, radar, and specialty silicon; wafer-level fan-out packages for use in ICs; and silicon wafer integrated fan-out technology, which replaces a laminate substrate with a thinner structure. Further, the company provides lead frame packages that are used in electronic devices for low to medium pin count analog and mixed-signal applications; substrate-based wirebond packages, which are used to connect a die to a substrate; micro-electro-mechanical systems (MEMS) packages that are miniaturized mechanical and electromechanical devices; and advanced system-in-package modules, which are used in radio frequency and front end modules, basebands, connectivity, fingerprint sensors, display and touch screen drivers, sensors and MEMS, and NAND memory and solid-state drives. It primarily serves integrated device manufacturers, fabless semiconductor companies, original equipment manufacturers, and contract foundries. Amkor Technology, Inc. was founded in 1968 and is headquartered in Tempe, Arizona.
CEO: --
Market: NASDAQ
Hot List
TradeSearchNews
SymbolLatest price%Chg

Loading...