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Tech company Tiancheng (688603.SH) currently shows good expansion in the growth rate of horizontal sink copper and electroplating products.
Tiancheng Technology (688603.SH) recently stated in a roadshow that PCB horizontal sunk copper and electroplating special chemicals are the company's core technology products, and the company is constantly expanding its downstream customer applications. With the continuous accumulation of technology and more customer recognition, the expansion rate of the company's horizontal sunk copper and electroplating products is showing a good trend. The domestication rate of these products is relatively low, mainly occupied by foreign enterprises such as Dowdupont, Ametek, JCU, and MacDermid. The company will continue to achieve import substitution through independent innovation, promote the increase of domestication rate of high-end functional wet electronic chemicals.
Tiancheng Technology (688603.SH): actively researching and developing Damascus plating solution products.
Tiancheng Technology (688603.SH) recently stated during a roadshow that the company's advanced packaging products mainly focus on RDL, bumping, TSV and TGV, and its related electroplating additives have been developed and are currently undergoing continuous verification by downstream customers, with good test results that meet customer expectations. The company will accept factory inspections from terminal customers in the future. At the same time, the company is actively developing its Damascus plating solution product.
Tiancheng Technology (688603.SH): has already conducted research and technology reserves related to glass substrate via hole filling, and has successfully developed the SkyFab THF series products for TGV.
Tiancheng Technology (688603.SH) recently stated during its roadshow that TGV in the packaging field refers to the glass substrate hole-filling process. TGV's advantages over TSV are reflected in the glass substrate's excellent high-frequency electrical properties, low cost and easy availability, and strong stability. It is another revolution in packaging technology. The company has already carried out related research and development and technical reserves for glass substrate via-hole filling, and has successfully developed the SkyFab THF series products for TGV. It is currently seizing the opportunity to expand downstream. The company is currently in close contact with all parties involved in the glass substrate.
Tiancheng Technology (688603.SH): The sales volume of the company in the second quarter of 2024 has shown a good growth trend so far.
Tiancheng Technology (688603.SH) recently stated in a roadshow that thanks to the improved prosperity of the downstream electronic circuit industry and the continuous expansion of the company's new and existing customer electroplating lines, the sales volume of the company in the second quarter of 2024 has shown a good growth trend so far.
Tiancheng Technology (688603.SH) plans to distribute 0.34 yuan per share in 2023, with ex-rights and ex-dividends on June 21st.
Tiancheng Technology (688603.SH) announced that the 2023 annual equity distribution plan for the company is to distribute cash dividends of 1 yuan (tax included) for every 10 shares and to convert capital reserve into share capital.
Guangdong Skychem Technology Co., Ltd.'s (SHSE:688603) Most Bullish Insider Is Senior Key Executive Jiangbo Liu, and Their Holdings Value Went up by 14% Last Week
Key Insights Insiders appear to have a vested interest in Guangdong Skychem Technology's growth, as seen by their sizeable ownership A total of 5 investors have a majority stake in the company with
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