About Union Semiconductor Company

The company is a high-end advanced packaging testing service provider for integrated circuits. Currently, it focuses on the field of display driver chips and has a leading position in the industry. The company's main business is the core of the previous stage of gold bump manufacturing (GoldBumping), and integrates wafer testing (CP), backstage glass crystal-coated packaging (COG) and thin-film crystal-clad packaging (COF) links to form a comprehensive service capability for packaging testing the entire process of display driver chips. The company's packaging testing services are mainly used in display driver chips for various mainstream panels such as LCD and AMOLED. The chips tested are core components of various terminal products such as smartphones, smart wearables, high-definition TVs, laptops, and tablets used on a daily basis to achieve image display. The company's main business is the core of the previous stage of gold bump manufacturing (GoldBumping), and integrates wafer testing (CP), backstage glass crystal-coated packaging (COG) and thin-film crystal-clad packaging (COF) links to form a comprehensive service capability for packaging testing the entire process of display driver chips. The company's current packaging testing products are mainly used in the field of display drivers, with the goal of providing full-process packaging testing. The package testing services involved include gold bump manufacturing (GoldBumping), wafer testing (CP), glass crystal-coated packaging (COG), and thin-film crystal-coated packaging (COF) according to specific process processes. Honors such as Best Quality Supplier issued by Lianyong Technology, the world's leading display driver IC design company.