The company was born in 2006 in Shenzhen, the forerunner of China's reform and opening up. Based on the research and application of IC packaging and testing technology, the company is a national high-tech enterprise engaged in IC packaging and testing and providing packaging technology solutions. The company was listed on the Shanghai Stock Exchange Science and Technology Innovation Board on June 23, 2021, with the stock code 688216. Since its inception, the company has been engaged in integrated circuit packaging, testing business. The company's main packaging technology products include MEMS, FC, Qipai, CPC, SOP, SOT, LQFP, QFN/DFN, CDFN/CQFN, DIP and other series of more than 190 products. Corporate Honor: in 2017, China's semiconductor packaging has the most potential enterprises, Shenzhen high-tech enterprises, national high-tech enterprises, etc.
CEO： Dazhong Liang