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Multi-dimentional Analyses
Company Valuation Capital Tracking Short Selling Data
01415 COWELL
10.880
-0.380-3.37%
YOY
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(Q6)2022/06/30(FY)2021/12/31(Q6)2021/06/30(FY)2020/12/31
Turnover
35.92% 404.55M 6.54% 799.29M -3.22% 297.63M 38.26% 750.2M
Operating income
35.92% 404.55M 6.54% 799.29M -3.22% 297.63M 38.26% 750.2M
Cost of sales
-36.50% -344.47M -7.45% -678.79M 2.45% -252.35M -35.71% -631.75M
Operating expenses
-36.50% -344.47M -7.45% -678.79M 2.45% -252.35M -35.71% -631.75M
Gross profit
32.69% 60.08M 1.73% 120.5M -7.29% 45.28M 53.64% 118.45M
Selling expenses
34.03% -787K 35.10% -1.98M 0.58% -1.19M -40.40% -3.05M
Administrative expenses
-56.69% -29.34M -9.33% -44.57M -6.89% -18.72M -16.87% -40.77M
Special items of operating profit
150,700.00% 6.03M 27.84% -15.34M -99.92% 4K -145.18% -21.26M
Operating profit
41.88% 35.99M 9.80% 58.61M -27.28% 25.37M 70.15% 53.38M
Financing cost
-330.10% -1.73M -26.13% -893K -11.98% -402K 11.50% -708K
Earning before tax
37.24% 34.26M 9.58% 57.72M -27.69% 24.97M 72.37% 52.67M
Tax
-26.13% -3.11M 22.81% -7.91M 61.25% -2.47M -703.21% -10.25M
After-tax profit from continuing operations
38.45% 31.16M 17.41% 49.81M -20.10% 22.5M 44.88% 42.42M
Earning after tax
38.45% 31.16M 17.41% 49.81M -20.10% 22.5M 44.88% 42.42M
Minority profit
-- -236K -- -- -- -- -- --
Profit attributable to shareholders
39.50% 31.39M 17.41% 49.81M -20.10% 22.5M 44.88% 42.42M
Basic earnings per share
40.74% 0.038 17.65% 0.06 -20.59% 0.027 45.71% 0.051
Diluted earnings per share
33.33% 0.036 15.69% 0.059 -20.59% 0.027 45.71% 0.051
Currency Unit
USDUSDUSDUSD
Accounting Standards
IASIASIASIAS
Audit Opinions
--Unqualified Opinion--Unqualified Opinion
Auditor
--KPMG accounting firm--KPMG accounting firm

Q6, Q9, and FY are cumulative quarterly reports: Q6 is the interim report; Q9 is third quarter report; FY is the annual report.

The MOM data from the Quarterly report,MOM=(current period - last period)/last period *100%

Company Overview More
Our camera modules use "flip chip" technology (semiconductor processor chips (usually wafers) are mounted directly to the substrate in a "flip" manner) or "chips on board" technology (wafers are mounted directly with wire and electrically interconnected to the substrate). It became the sixth largest supplier of camera modules in the world in 2013. With our experience and expertise in manufacturing camera modules based on COB technology, we began to use advanced flip chip technology to produce fixed-focus camera modules in 2012.
CEO: Yan Meng
Market: Hong Kong motherboard
Listing Date: 03/31/2015
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