Our camera modules use “inverted chip” technology (in which a semiconductor processor chip (generally referred to as a chip) is directly attached to the substrate in an “inverted” manner) or “on-board chip” technology (the chip is attached directly to the board using a metal wire and electrically interconnected to the board). It became the sixth largest camera module supplier in the world in 2013. With our experience and expertise in manufacturing camera modules based on COB technology, we began producing fixed focus camera modules using advanced flip chip technology in 2012.
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