002436 Shenzhen Fastprint Circuit Tech
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Shenzhen Fastprint Circuit Tech News
Xing Sen Technology (002436.SZ): FCBGA packaging substrates are raw materials for chip packaging and can be used in advanced packaging technologies such as 2.5D and 3D
Gelonghui, May 13丨An investor asked Xing Sen Technology (002436.SZ) on the investor interactive platform, “Advanced chip packaging technology has become mainstream in AI chip packaging. Do advanced packaging technologies such as wafer-level packaging, 2.5D, and 3D have to use FCBGA carriers? Which manufacturers are currently supplying the company's FCBGA carrier boards?” The company replied that the company's FCBGA packaging substrate is a raw material for chip packaging and can be applied to advanced packaging technologies such as 2.5D and 3D, and that chip design companies and packaging manufacturers at home and abroad are the company's target customers.
Xing Sen Technology (002436.SZ): Guoneng Tongxin has raised a total of 22.9 million yuan in capital
Gelonghui, April 29丨Xing Sen Technology (002436.SZ) announced that the company and Shenzhen Guoneng Jinhui Asset Management Co., Ltd., Li Xuqiang and Cheng Jiangbo jointly signed the “Gongqingcheng Guoneng Tongxin Venture Capital Fund Partnership (Limited Partnership)”. As a limited partner, the company participated in the establishment of the Gongqingcheng Guoneng Tongxin Venture Capital Fund Partnership (Limited Partnership) (hereinafter referred to as “Guoneng Tongxin”), accounting for 47.5983% of the pledged capital. Recently, the company received a notice from the fund manager that Guoneng Tongxin has completed its fundraising and raised sufficient capital
Xing Sen Technology (002436.SZ): Net profit of 24.82 million yuan in the first quarter increased 230.82% year-on-year
Gelonghui, April 24 | Xing Sen Technology (002436.SZ) released its first quarter report. Operating revenue was 1,388 billion yuan, up 10.92% year on year, net profit of 24.82 million yuan, up 230.82% year on year, after deducting non-net profit of 239.266 million yuan, up 2500.78% year on year, with basic earnings of 0.01 yuan per share.
Pulling Back 4.9% This Week, Shenzhen Fastprint Circuit TechLtd's SZSE:002436) Five-year Decline in Earnings May Be Coming Into Investors Focus
It might be of some concern to shareholders to see the Shenzhen Fastprint Circuit Tech Co.,Ltd. (SZSE:002436) share price down 23% in the last month. But that doesn't change the fact that the retur
Xing Sen Technology (002436.SZ): There is currently no cooperation with DJI
Gelonghui, April 1 | Xing Sen Technology (002436.SZ) said on the investor interactive platform that the company currently has no cooperation with DJI. In the field of low-altitude flight, the company provides customers with products, and currently accounts for a relatively small share of revenue.
Xing Sen Technology (002436.SZ): The application fields of CSP packaging substrates cover memory chips, application processor chips, sensor chips, RF chips, etc.
Gelonghui, March 27丨Xing Sen Technology (002436.SZ) said on the investor interactive platform that the application fields of the company's CSP packaging substrates cover memory chips, application processor chips, sensor chips, RF chips, etc., and are indirectly supplied to domestic mobile phone manufacturers in the fields of memory chips, RF chips, etc., but according to the 2022 annual report data, CSP packaging substrates account for only 12.88% of the company's overall revenue.
Shenzhen Fastprint Circuit Tech Co.,Ltd. (SZSE:002436) Most Popular Amongst Retail Investors Who Own 39% of the Shares, Institutions Hold 33%
Key Insights Significant control over Shenzhen Fastprint Circuit TechLtd by retail investors implies that the general public has more power to influence management and governance-related decisions 5
Xing Sen Technology (002436.SZ): The company's FCBGA packaging substrate can be used to package HBM storage
Gelonghui, March 20 | Xing Sen Technology (002436.SZ) said on the investor interactive platform that HBM will not be packaged separately, but will be packaged together with the CPU/GPU through an FCBGA package substrate. The company's FCBGA packaging substrate can be used for packaging HBM storage, but it has not yet entered the leading overseas HBM industry chain.
Xing Sen Technology (002436.SZ) plans to join Guoneng Tongxin Venture Capital Fund Partnership
Xing Sen Technology (002436.SZ) issued an announcement. The company recently cooperated with Shenzhen Guoneng Jinhui Asset Management Co., Ltd.,...
Xing Sen Technology (002436.SZ): FCBGA packaging substrates are mainly used in CPU, GPU, FPGA, ASIC and other chip fields
Gelonghui March 11 丨 Some investors asked Xing Sen Technology (002436.SZ) on the investor interactive platform. “The company previously mentioned that some FCBGA packaging substrates are already undergoing customer certification. Currently, there are three certified customers, Huahaihan, on the Internet.” The company replied that the company's FCBGA packaging substrates are mainly used in CPU, GPU, FPGA, ASIC and other chip fields. Chip design companies and packaging and testing manufacturers are all target customers of the company's packaging substrates. The company is based on expanding overseas customers on the basis of serving leading customers in the domestic chip industry. Currently
Xing Sen Technology (002436.SZ): The company's CSP packaging substrates are mainly used in the fields of memory chips, RF chips, etc.
Gelonghui, March 4 | Xing Sen Technology (002436.SZ) said on the investor interactive platform that the company's CSP packaging substrates are mainly used in the fields of memory chips, RF chips, etc.; FCBGA packaging substrates are mainly used in CPU, GPU, FPGA, ASIC and other chip fields. Chip design companies and packaging manufacturers are all target customers of the company's packaging substrates, and the company is based on expanding overseas customers on the basis of serving leading customers in the domestic chip industry.
Xing Sen Technology (002436.SZ): FCBGA packaging board business is in the business development stage
Gelonghui, March 4 | Xing Sen Technology (002436.SZ) said on the investor interaction platform that the server industry accounts for about 15% of the company's traditional PCB business; FCBGA packaging substrates are packaging materials for CPU, GPU, FPGA, ASIC and other chips. Related chips are widely used in the server field, and the company's FCBGA packaging substrate business is in the business development stage.
Market Might Still Lack Some Conviction On Shenzhen Fastprint Circuit Tech Co.,Ltd. (SZSE:002436) Even After 30% Share Price Boost
Those holding Shenzhen Fastprint Circuit Tech Co.,Ltd. (SZSE:002436) shares would be relieved that the share price has rebounded 30% in the last thirty days, but it needs to keep going to repair the r
Xing Sen Technology (002436.SZ): spent 31.108 million yuan to buy back 2.4 million shares
Gelonghui, Feb. 29丨Xing Sen Technology (002436.SZ) announced that on February 28, 2024, for the first time, the company repurchased 2,400,000 shares of the company's shares through a special stock repurchase account, accounting for 0.14% of the company's current total share capital. The highest transaction price was 13.03 yuan/share, the minimum transaction price was 12.65 yuan/share, and the total amount paid was 31,108,487.50 yuan. The implementation of the company's share repurchase has been completed.
Shenzhen Fastprint Circuit TechLtd (SZSE:002436) Is Making Moderate Use Of Debt
Some say volatility, rather than debt, is the best way to think about risk as an investor, but Warren Buffett famously said that 'Volatility is far from synonymous with risk.' So it might be obvious
Xing Sen Technology (002436.SZ): No cooperation with Nvidia
Gelonghui, Feb. 28 | Xing Sen Technology (002436.SZ) said on the investor interactive platform that the company has not yet cooperated with Nvidia. Customer certification and mass production of the FCBGA packaging substrate project are progressing in an orderly manner according to the plan, and the specific supply pace is based on customer order requirements.
Xing Sen Technology (002436.SZ): Plans to spend 30 million yuan to 50 million yuan to buy back shares
Gelonghui, Feb. 27丨Xing Sen Technology (002436.SZ) announced that the company plans to buy back shares through centralized bidding transactions through the Shenzhen Stock Exchange trading system. The total capital for this share repurchase is not less than RMB 30 million (inclusive) and not more than RMB 50 million (inclusive). The repurchase price is no more than 16.84 yuan/share. Under the condition that the repurchase price does not exceed 16.84 yuan/share, based on the upper limit of the repurchase amount, the estimated number of shares that can be repurchased is about 2,969,121 shares, accounting for about 0.18% of the company's total issued share capital; based on the lower limit of the repurchase amount, pre-estimated
Xing Sen Technology (002436.SZ): The UK production base Exception and the overseas sales platform Fineline are both overseas subsidiaries
Gelonghui, Feb. 26 | Xing Sen Technology (002436.SZ) said on the investor interactive platform that the company's FCBGA packaging substrate is the packaging material for AI chips, and the FCBGA packaging substrate project is progressing in an orderly manner according to the plan. The company maintains good technical and business exchanges with domestic and foreign customers. The UK production base Exception and the overseas sales platform Fineline are both overseas subsidiaries.
Xing Sen Technology (002436.SZ): The company has the ability to manufacture large high-rise ultra-fine line FCBGA packaging substrates
Gelonghui, Feb. 26 | Xing Sen Technology (002436.SZ) said on the investor interactive platform that the company has the ability to manufacture FCBGA packaging substrates for large high-rise ultra-fine circuits.
Xing Sen Technology (002436.SZ): The downstream application communication of the company's PCB business products accounts for about 1/3, and servers account for about 15%
Gelonghui, February 22丨Xing Sen Technology (002436.SZ) said on the investor interactive platform that M4 and M6 materials are mainly used in products involving high-speed transmission of data signals, such as 5G, servers, etc. Downstream application communication accounts for about 1/3 of the company's PCB business products, and servers account for about 15%.
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