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Xing Sen Technology (002436.SZ): Guoneng Tongxin has raised a total of 22.9 million yuan in capital
Gelonghui, April 29丨Xing Sen Technology (002436.SZ) announced that the company and Shenzhen Guoneng Jinhui Asset Management Co., Ltd., Li Xuqiang and Cheng Jiangbo jointly signed the “Gongqingcheng Guoneng Tongxin Venture Capital Fund Partnership (Limited Partnership)”. As a limited partner, the company participated in the establishment of the Gongqingcheng Guoneng Tongxin Venture Capital Fund Partnership (Limited Partnership) (hereinafter referred to as “Guoneng Tongxin”), accounting for 47.5983% of the pledged capital. Recently, the company received a notice from the fund manager that Guoneng Tongxin has completed its fundraising and raised sufficient capital
Gelonghui FinanceApr 29 03:57 ET
Xing Sen Technology (002436.SZ): Net profit of 24.82 million yuan in the first quarter increased 230.82% year-on-year
Gelonghui, April 24 | Xing Sen Technology (002436.SZ) released its first quarter report. Operating revenue was 1,388 billion yuan, up 10.92% year on year, net profit of 24.82 million yuan, up 230.82% year on year, after deducting non-net profit of 239.266 million yuan, up 2500.78% year on year, with basic earnings of 0.01 yuan per share.
Gelonghui FinanceApr 24 06:11 ET
Pulling Back 4.9% This Week, Shenzhen Fastprint Circuit TechLtd's SZSE:002436) Five-year Decline in Earnings May Be Coming Into Investors Focus
It might be of some concern to shareholders to see the Shenzhen Fastprint Circuit Tech Co.,Ltd. (SZSE:002436) share price down 23% in the last month. But that doesn't change the fact that the retur
Simply Wall StApr 20 21:18 ET
Xing Sen Technology (002436.SZ): There is currently no cooperation with DJI
Gelonghui, April 1 | Xing Sen Technology (002436.SZ) said on the investor interactive platform that the company currently has no cooperation with DJI. In the field of low-altitude flight, the company provides customers with products, and currently accounts for a relatively small share of revenue.
Gelonghui FinanceApr 1 03:30 ET
Xing Sen Technology (002436.SZ): The application fields of CSP packaging substrates cover memory chips, application processor chips, sensor chips, RF chips, etc.
Gelonghui, March 27丨Xing Sen Technology (002436.SZ) said on the investor interactive platform that the application fields of the company's CSP packaging substrates cover memory chips, application processor chips, sensor chips, RF chips, etc., and are indirectly supplied to domestic mobile phone manufacturers in the fields of memory chips, RF chips, etc., but according to the 2022 annual report data, CSP packaging substrates account for only 12.88% of the company's overall revenue.
Gelonghui FinanceMar 27 03:42 ET
Shenzhen Fastprint Circuit Tech Co.,Ltd. (SZSE:002436) Most Popular Amongst Retail Investors Who Own 39% of the Shares, Institutions Hold 33%
Key Insights Significant control over Shenzhen Fastprint Circuit TechLtd by retail investors implies that the general public has more power to influence management and governance-related decisions 5
Simply Wall StMar 23 22:00 ET
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