Tongfu Microelectronics (002156.SZ): The memory production line, which has been in place for many years, has steadily entered the mass production stage
Gelonghui, May 22丨Tongfu Microelectronics (002156.SZ) said on the investor interactive platform that in 2023, the company will continue to grow in the memory business. As memory chip technology becomes more mature, the company's long-standing memory production line has steadily entered the mass production stage and significantly increased the company's market share in related fields.
Huafu Securities: Chiplet adapts to the development needs of the AI era and the future layout will continue to deepen
The Zhitong Finance App learned that Huafu Securities released a research report saying that according to SEMI data, on the one hand, global chip production capacity will increase by 6.4% by 2024, and China will lead the increase in world semiconductor production; on the other hand, equipment expenses for global front-end 300mm fabs will resume growth in 2024. Chiplet adapts to the development needs of the AI era, drastically reduces chip design and manufacturing costs through “deconstructure-restructure-reuse”, and realizes heterogeneous restructuring. Currently, Chiplet mainly uses multiple packaging technologies such as MCM, InFO, CowOS, and EMIB
These 4 Measures Indicate That Tongfu MicroelectronicsLtd (SZSE:002156) Is Using Debt Extensively
Some say volatility, rather than debt, is the best way to think about risk as an investor, but Warren Buffett famously said that 'Volatility is far from synonymous with risk.' So it seems the smart m
Tongfu MicroelectronicsLtd's (SZSE:002156) Problems Go Beyond Weak Profit
Investors were disappointed by Tongfu Microelectronics Co.,Ltd's (SZSE:002156 ) latest earnings release. Our analysis has found some reasons to be concerned, beyond the weak headline numbers. SZS
Results: Tongfu Microelectronics Co.,Ltd Beat Earnings Expectations And Analysts Now Have New Forecasts
Last week, you might have seen that Tongfu Microelectronics Co.,Ltd (SZSE:002156) released its full-year result to the market. The early response was not positive, with shares down 3.5% to CN¥20.50 in
Tongfu Microelectronics Co.,Ltd's (SZSE:002156) Fundamentals Look Pretty Strong: Could The Market Be Wrong About The Stock?
Tongfu MicroelectronicsLtd (SZSE:002156) has had a rough month with its share price down 16%. But if you pay close attention, you might find that its key financial indicators look quite decent, whic
Tongfu Microelectronics (002156.SZ): 2023 net profit of 169 million yuan, plans to distribute 10 to 0.12 yuan
Gelonghui, April 12: Tongfu Microelectronics (002156.SZ) announced its 2023 annual report. In 2023, the company achieved operating income of 22.269 billion yuan, a year-on-year increase of 3.92%; net profit attributable to shareholders of listed companies was 169 million yuan, a year-on-year decrease of 66.24%; net profit attributable to shareholders of listed companies after deducting non-recurring gains and losses was 594.8835 million yuan, a year-on-year decrease of 83.31%; basic earnings per share of 0.11 yuan; it is intended to distribute a cash dividend of 0.12 yuan (tax included) for every 10 shares to all shareholders.
Zhongtai Securities: Three original manufacturers have started an arms race, and targets related to the domestic HBM industry chain are expected to benefit
Zhongtai Securities pointed out that the supply of HBM is currently in short supply, and the three major original manufacturers have begun an arms race. On the one hand, the three original manufacturers have expanded production to meet market demand and seize share. Hynix and Samsung have both increased HBM production capacity by 2 times + in 24 years.
Recent 13% Pullback Isn't Enough to Hurt Long-term Tongfu MicroelectronicsLtd (SZSE:002156) Shareholders, They're Still up 112% Over 5 Years
The Tongfu Microelectronics Co.,Ltd (SZSE:002156) share price has had a bad week, falling 13%. But that doesn't change the fact that the returns over the last five years have been very strong. Ind
Tongfu Microelectronics (002156.SZ) has mastered ultra-multi-chip FCBGA MCM technology to achieve integration of up to 13 chips and an oversized package of 100 x 100 mm or more
Gelonghui, March 15 | Tongfu Microelectronics (002156.SZ) said on the investor interactive platform that as a national high-tech enterprise, the company has undertaken a number of national technological transformation, scientific and technological research projects, and has achieved fruitful technological innovation results. Among them, the company has mastered FCBGA MCM technology for a large number of chips, integrating up to 13 chips and achieving an oversized package of 100 x 100 mm or more.
Tongfu Microelectronics (002156.SZ): Currently, HBM related technology is in a growth period
Gelonghui, March 15 | Tongfu Microelectronics (002156.SZ) said on the investor interactive platform that the company has vigorously developed fan-out, wafer level, reverse welding and other packaging technologies and expanded its production capacity in application fields such as high-performance computing, memory, automotive electronics, display drivers, 5G, etc.; in addition, the company can provide customers with diverse Chiplet packaging solutions through advanced packaging technologies such as multi-chip components, integrated fan-out packaging, and 2.5D/3D. The company's HBM related technology is currently in a growth period, and the company will continue to use this technology
Guotai Junan: AI computing power boosts HBM demand, and domestic supply chains are expected to benefit
The Zhitong Finance App learned that Guotai Junan released a research report saying that due to AI computing power demand, the medium- to long-term HBM demand growth rate is expected to reach 40% per year. Hynix will invest 1 billion US dollars to develop HBM. By the end of 2024, Hynix HBM production capacity will double, and the shipment volume is expected to reach 100 million units by 2030. Samsung HBM will invest 700-1000 billion won in new packaging lines, and shipments are expected to increase 2.5 times in 2024. The bank believes that AI computing power will drive mass production of HBM, and Hynix HBM3E is expected to be mass-produced in March 2024
Huajin Securities: HBM becomes the strongest AI chip to help accelerate the domestic supply chain
The global HBM market is expected to exceed 10 billion US dollars in 2024, with sufficient market space and accelerated support for the domestic supply chain.
Dragon Tiger List | 2 institutions escaped Tongfu Microelectronics for 193 million dollars, Ge Weidong traded stocks to support his family and buy high-tech development
Over 200 million dollars to raise Senyuan shares
Tongfu Microelectronics Co.,Ltd (SZSE:002156) Surges 26% Yet Its Low P/S Is No Reason For Excitement
Tongfu Microelectronics Co.,Ltd (SZSE:002156) shareholders are no doubt pleased to see that the share price has bounced 26% in the last month, although it is still struggling to make up recently lost
Tongfu MicroelectronicsLtd (SZSE:002156) Has Some Way To Go To Become A Multi-Bagger
What are the early trends we should look for to identify a stock that could multiply in value over the long term? Ideally, a business will show two trends; firstly a growing return on capital employe
Huaan Securities: Advanced Packaging Accelerates Iteration Towards 2.5D/3D Packaging and Recommends Relevant Domestic Standards
The popularity of advanced packaging is higher than that of the overall packaging industry, and the future is moving towards 2.5D/3D.
Tongfu Microelectronics (002156.SZ): The company has a sealed test project involving the AMD chip Instinct MI300
On February 7, Gelonghui | Tongfu Microelectronics (002156.SZ) said on the investor interactive platform that the company has a sealed test project involving the AMD chip Instinct MI300.
Is Tongfu MicroelectronicsLtd (SZSE:002156) A Risky Investment?
Some say volatility, rather than debt, is the best way to think about risk as an investor, but Warren Buffett famously said that 'Volatility is far from synonymous with risk.' It's only natural to co
The top public offering of high-ranking stocks has been released! New entrants, bucking the trend, and big reshuffles...
The public offering of top stock positions has been released
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