On July 29, Global Wealth News announced that the new high-performance automotive electronic MCU product, CCFC3012PT, successfully passed the company's internal testing. This new generation of multi-core MCU chips is based on the company's self-developed PowerPC architecture C*CoreCPU kernel and is suitable for intelligent driving assistance, intelligent cabins, and high-integration domain controllers. It can better meet customers' application needs for higher computing power, higher information security levels, and higher functional safety levels.
This chip is developed and produced based on 40nmeFlash technology, embedding 10 arithmetic CPU cores, including 6 main cores and 4 lock-step cores, with a double-emission pipeline architecture. Its DMIPS performance reaches 2.29/MHz, a 20% increase compared to the single core performance of CCFC3007PT chip in the same series. The chip also has a built-in hardware security HSM module, supporting international and national secret algorithms such as Crypto/SM2/AES/SM4, and can support secure boot and OTA. The chip has a variety of independent automotive standard communication interfaces, including: TSN protocol 100M/1000M Ethernet interface (1 channel), FlexRay (2 channels), Lin (12 channels, supporting LIN and UART), CANFD (12 channels), and external control interface eMIOS (32 channels), GTM4 (96 channels) latest version of general timing processing unit, and serial communication interface DSPI (22 channels, supporting 4 channels of MSC). The chip also has a large storage space, with a maximum configuration of 16.5M bytes for program storage Flash, 1M bytes for data storage Flash, and 2.4M bytes for memory space (SRAM), equipped with SDADC (14) and SARADC (13) control circuits.
The new high-performance automotive electronic MCU product CCFC3012PT that passed the internal test this time is designed and produced based on the Grade1 level for automotive electronics, the Evita-Full level for information security, and the ASIL-D level for functional safety. It has high reliability and security and can be applied to demanding scenarios, thereby increasing the product's application coverage. The package forms of this product include BGA516/BGA292, which can be used as an MCU chip for automotive intelligent driving assistance, intelligent cabins, and high-integration domain controllers, in the field of functional safety and information fusion processing, comparable to the TC397/TC399 series of MCU chips from Infineon that have been widely used in automatic driving, intelligent cabins, and high integration area control.