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弘信电子(300657.SZ)：2023年公司开始布局AI算力服务器的研发、设计、制造和销售，AI算力租赁业务

Xiamen Hongxin Electronics Technology Group Inc. (300657.SZ) will start R&D, design, manufacturing, and sales of AI computing servers in 2023, as well as AI computing leasing business.

Gelonghui Finance ·  Jun 25 05:28

On June 25th, Gloonews reported that Xiamen Hongxin Electronics Technology Group Inc. (300657.SZ) stated on its investor interaction platform that the printed circuit board (PCB) is a substrate used for assembling electronic product components. It is a printed board formed by interconnecting points according to a predetermined design on a universal substrate. As a substrate and key interconnect component loaded with electronic components, PCB mainly plays a role in connection and signal transmission and is known as the "mother of electronic products." According to flexibility, PCB can be divided into rigid PCBs (commonly known as "hard boards"), flexible PCBs (FPC commonly known as "soft boards"), and rigid-flex PCBs (also known as "flexible-hard combination boards"). FPC is a highly reliable and flexible printed circuit board made of flexible copper-clad laminate as the substrate. As an important category of PCB, FPC has advantages that other types of circuit boards cannot match, such as high wiring density, light weight, thin thickness, foldability, bending, and three-dimensional wiring, and is widely used in modern electronic products. Since its inception, the company has focused on the FPC industry for a long time and is one of the leading domestic FPC enterprises. After 20 years of growth and operation, it has become a well-known FPC manufacturing enterprise with leading technology, strong strength, top production and output, and comprehensive strength. In 2023, the company will begin to develop, design, manufacture, and sell AI computing power servers and AI computing power leasing businesses. The company is positioned as a provider of computing hardware and overall solutions, deeply researching and developing upstream core components and materials for computing hardware, and is expected to achieve the effective integration of flexible circuit boards and computing hardware.

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