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三孚新科(688359.SH)：创新的中低温铝代铜连续镀工艺主要应用于PCB、LED等领域

Sanfu Xinke (688359.SH): Innovative continuous plating process for medium and low temperature aluminum instead of copper is mainly used in PCB, LED and other fields

Gelonghui Finance ·  May 22 05:25

Gelonghui, May 22丨Sanfu Xinke (688359.SH) said on the interactive platform that the company's innovative medium and low temperature aluminum instead of copper plating process is mainly used in PCB, LED and other fields. Through electroplating, a thin layer of copper is coated on the surface of aluminum foil or aluminum-coated soft board to form aluminum-based copper foil or aluminum-based soft board. The “copper-aluminum combination” scheme has replaced the traditional “all copper” scheme, reducing the consumption of copper metal, thereby greatly saving copper costs for downstream customers. This innovative process has a series of advantages such as simple process and low overall cost, and will later penetrate more electronic fields. The specific customer situation is not convenient to be announced at this time.

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