Gelonghui, May 17丨Core Technology (688230.SH) recently said during a survey reception from institutional investors that while upgrading and iterating existing products, the company is also continuously enriching its product lineup. The company's third-generation semiconductor 650V GaN HEMT products have been initially serialized, covering the 110mR~900mR range. Using various packaging forms, they are being promoted mainly in the fields of power supplies and PD fast charging adapters.
In terms of IGBT products, the company's low current products below 650V/1200V 100A have initially formed a product series. The flow capacity is in the range of 25A to 75A, using the TO-247/TO-247PLUS single tube package format, which is currently being promoted mainly in industrial control and other fields. At the same time, the company's high current product design and process platform above 1200V 100A was built, and the first 1200V 200A chip completed testing and evaluation. The parameters were consistent and had high reliability and strong robustness. Series products such as 1200V and 150A are being produced one after another. High-current products mainly use module packaging forms such as EconoDUAL3/62mm, and are mainly promoted in new energy fields such as energy storage.