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捷捷微电(300623.SZ)：功率半导体“车规级”封测产业化项目主要从事车规级大功率器件的研发、生产及销售

Jiejie Microelectronics (300623.SZ): The “vehicle grade” packaging and testing industrialization project for power semiconductors is mainly engaged in R&D, production and sales of automotive-grade high-power devices

Gelonghui Finance ·  May 14 03:52

Gelonghui, May 14, 丨 Jiejie Microelectronics (300623.SZ) said on the investor interactive platform that the power semiconductor “vehicle grade” packaging and testing industrialization project is mainly engaged in R&D, production and sales of automotive-grade high-power devices. After the construction of this project is completed, it can achieve an annual production capacity of 1900kK vehicle-grade high-power DFN series products, 120kK vehicle-grade high-power device Toll series products, 90kK vehicle-grade high-power device LFPack series products and 60kKW CSP power device products. The project is expected to generate a sales scale of 2 billion dollars after delivery. Current project progress: the plant has been capped, and other infrastructure and supporting facilities are under construction. The original plan was for the project to reach the intended usable state on June 30, 2023, but since 2022, the company's power semiconductor discrete device industry has declined markedly, the demand side of the market in consumer and industrial application fields has continued to decline, and uncertainties such as the macroeconomic environment at home and abroad have led to a slowdown in the company's project construction. Taking into account factors such as the company's current product structure and market demand, the estimated completion time of this project was adjusted and extended to December 31, 2024 on the basis of ensuring the orderly construction of the fund-raising investment project.

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