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Reported Earlier, SK Hynix And TSMC Collaborate On HBM4 Development And Next-Generation Packaging Technology

Benzinga ·  Apr 19 01:43
  • SK hynix and TSMC sign MOU to collaborate on HBM4 development and next-generation packaging technology
  • SK hynix will adopt TSMC's cutting-edge foundry process to advance HBM4 performance
  • Product Design-Foundry-Memory trilateral collaboration to break memory performance limits for AI applications
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