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中兴通讯(000063.SZ):不涉及芯片的生产制造领域

ZTE (000063.SZ): Does not involve the field of chip manufacturing

Gelonghui Finance ·  Apr 3 04:43

Gelonghui, April 3 丨 ZTE (000063.SZ) said on the investor interactive platform, Hello, thank you for your attention. 1. Chip companies focus on chip R&D and design, and do not involve the field of chip manufacturing. With years of chip research and development, the company's products cover all fields of “computing power, networks, and terminals” in the ICT industry. It continues to strengthen investment in advanced process design, advanced architecture and package design, core intellectual property rights, and digital efficient development platforms, and already has industry-leading chip design capabilities throughout the entire process. The company is rooted in DICT chip underlying technology research and development. At the same time, with the integrated development of computing networks, it has built an extremely efficient, green, and intelligent full-stack computing network platform around “data, computing power, and network”, and supports continuous competitiveness leadership by building a product system that meets the core needs of diverse “cloud, edge, and end” scenarios. 2. The server company has a full range of server products, including total computing, intelligent computing servers, etc. In terms of general-purpose servers, the company achieved significant improvements in the performance of server products in network processing and virtualization through hardware acceleration such as DPU and smart network cards. In terms of intelligent computing servers, the company has launched AI servers such as the R6500 G5 for small to medium model training and inference and large model inference requirements, as well as the AI server R6900 G5 designed specifically for training large models, etc., which are compatible with mainstream CPUs/GPUs at home and abroad. The company's full range of servers supports liquid cooling. Through a cold plate liquid cooling and cooling scheme, the power consumption of the whole machine can be reduced, and a better PUE can be achieved. At the same time, the cold plate and pipeline are connected with high reliability, intelligent monitoring of all pipelines, and second-level liquid leakage alarms to ensure product reliability while ensuring product reliability and meeting the needs of diverse computing power scenarios such as intelligent computing and high-performance computing.

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