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飞凯材料(300398.SZ):半导体封装材料可适用于多种先进封装形式

Feikai Materials (300398.SZ): Semiconductor packaging materials can be applied to a variety of advanced packaging forms

Gelonghui Finance ·  Apr 3 04:22

Gelonghui April 3 丨 Some investors asked Feikai Materials (300398.SZ) on the investor interactive platform, “Can the company's semiconductor packaging materials be applied to HBM materials?” The company replied that the company's semiconductor packaging materials can be applied to a variety of advanced packaging forms, and the specific application conditions depend on the packaging process requirements.

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