Huagong Technology (000988.SZ): The third-generation semiconductor wafer laser cutting equipment independently developed by Huagong Laser has completed testing

Gelonghui Finance · Apr 3 03:18

Gelonghui April 3 丨 Huagong Technology (000988.SZ) held a performance briefing on April 2 to discuss “the company's technology and product reserves in silicon carbide?” The company replied that as a new type of wide bandgap semiconductor material, silicon carbide has obvious advantages in power density and efficiency, and its application in new energy fields such as electric vehicles and photovoltaics is growing rapidly. The third-generation semiconductor wafer laser cutting equipment independently developed by Huagong Laser has completed testing. The products currently developed cover the front and back processes of compound semiconductors, including silicon carbide substrate appearance defect detection, wafer laser marking equipment, wafer laser annealing equipment, wafer laser cutting equipment, wafer laser invisibility equipment, and silicon carbide wafer key size measurement equipment.

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华工科技(000988.SZ)：华工激光自主研制的第三代半导体晶圆激光切割装备已完成测试

Huagong Technology (000988.SZ): The third-generation semiconductor wafer laser cutting equipment independently developed by Huagong Laser has completed testing

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