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兴森科技(002436.SZ)：CSP封装基板应用领域涵盖存储芯片、应用处理器芯片、传感器芯片、射频芯片等

Xing Sen Technology (002436.SZ): The application fields of CSP packaging substrates cover memory chips, application processor chips, sensor chips, RF chips, etc.

Gelonghui Finance ·  Mar 27 03:42

Gelonghui, March 27丨Xing Sen Technology (002436.SZ) said on the investor interactive platform that the application fields of the company's CSP packaging substrates cover memory chips, application processor chips, sensor chips, RF chips, etc., and are indirectly supplied to domestic mobile phone manufacturers in the fields of memory chips, RF chips, etc., but according to the 2022 annual report data, CSP packaging substrates account for only 12.88% of the company's overall revenue.

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