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兴森科技(002436.SZ):公司的FCBGA封装基板可用于HBM存储的封装

Xing Sen Technology (002436.SZ): The company's FCBGA packaging substrate can be used to package HBM storage

Gelonghui Finance ·  Mar 20 04:13

Gelonghui, March 20 | Xing Sen Technology (002436.SZ) said on the investor interactive platform that HBM will not be packaged separately, but will be packaged together with the CPU/GPU through an FCBGA package substrate. The company's FCBGA packaging substrate can be used for packaging HBM storage, but it has not yet entered the leading overseas HBM industry chain.

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