ASMPT (00522) rebounded more than 4%. As of press release, it rose 3.16% to HK$99.45, with a turnover of HK$79.423 million.
The Zhitong Finance App learned that ASMPT (00522) rebounded more than 4%. As of press release, it had risen 3.16% to HK$99.45, with a turnover of HK$79.423 million.
According to media reports, according to media reports, TSMC will increase investment in the new advanced packaging factory in the Chiayi Science Park. The park will allocate land for six new plants to TSMC, with a total investment of over NT$500 billion, mainly to expand CoWoS advanced packaging production capacity. Furthermore, people familiar with the matter revealed that TSMC is considering building advanced chip packaging production capacity in Japan, and one option is to introduce its CoWoS packaging technology into Japan. The review process is at an early stage, and no decision has yet been made on the size or timeline of potential investments.
Damo previously stated that ASMPT is the main supplier of 2.5D advanced packaging thermocompression crystallization welding (TCB), and the technology is used in products such as TSMC Cowos and HBM. Goldman Sachs, on the other hand, said it still has a positive attitude towards ASMPT's medium- to long-term development prospects, benefiting from artificial intelligence, high-performance computing systems (HPC) and memory customers.