share_log

兴森科技(002436.SZ)：FCBGA封装基板主要应用于CPU、GPU、FPGA、ASIC等芯片领域

Xing Sen Technology (002436.SZ): FCBGA packaging substrates are mainly used in CPU, GPU, FPGA, ASIC and other chip fields

Gelonghui Finance ·  Mar 11 03:55

Gelonghui March 11 丨 Some investors asked Xing Sen Technology (002436.SZ) on the investor interactive platform. “The company previously mentioned that some FCBGA packaging substrates are already undergoing customer certification. Currently, there are three certified customers, Hua Haihan, on the Internet.” The company replied that the company's FCBGA packaging substrates are mainly used in CPU, GPU, FPGA, ASIC and other chip fields. Chip design companies and packaging and testing manufacturers are all target customers of the company's packaging substrates. The company is based on expanding overseas customers on the basis of serving leading customers in the domestic chip industry. Currently, the project is in the business development stage, and all work is progressing in an orderly manner according to plan.

Disclaimer: This content is for informational and educational purposes only and does not constitute a recommendation or endorsement of any specific investment or investment strategy. Read more
    Write a comment