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飞凯材料(300398.SZ):液体封装材料LMC已量产并形成少量销售

Feikai Materials (300398.SZ): Liquid packaging material LMC has been mass-produced and sold in small quantities

Gelonghui Finance ·  Mar 11 03:18

Gelonghui, March 11 | Feikai Materials (300398.SZ) said on the investor interactive platform that epoxy encapsulants are one of the materials required for HBM memory chip manufacturing technology. MUF materials are divided into different varieties according to properties and processes. Currently, the company's MUF material products include liquid packaging materials LMC and GMC granular encapsulants. The liquid packaging material LMC has been mass-produced and sold in small quantities, and GMC is still in the development and sample stage.

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