Intel And Cadence Expand Partnership In Multiyear Agreement To Enable Best-In-Class SoC Design On Intel's Advanced Processes
Intel And Cadence Expand Partnership In Multiyear Agreement To Enable Best-In-Class SoC Design On Intel's Advanced Processes
- Multiyear agreement to enable best-in-class system-on-chips (SoCs) for the AI, high performance computing (HPC) and mobile markets.
- Joint development on customized intellectual property (IP), design flows and design techniques for Intel's most advanced RibbonFET processes on Intel 18A and beyond.
- Further strengthening of strong existing partnership to advance Intel's IDM 2.0 strategy, creating a more robust offering for new and existing Intel Foundry Services (IFS) customers.
- 爲期多年的協議，旨在爲人工智能、高性能計算 (HPC) 和移動市場提供一流的片上系統 (SoC)。
- 在英特爾 18A 及更高版本上聯合開發英特爾最先進的 RibbonFET 工藝的定製知識產權 (IP)、設計流程和設計技術。
- 進一步加強現有的強大合作伙伴關係，推進英特爾的 IDM 2.0 戰略，爲新的和現有的英特爾代工服務 (IFS) 客戶創造更強大的產品。
Intel Foundry Services (IFS) andCadence Design Systems, Inc. (NASDAQ:CDNS) announced they have expanded their partnership and entered into a multiyear strategic agreement to jointly develop a portfolio of key customized IP, optimized design flows and techniques for Intel 18A technology featuring RibbonFET gate-all-around transistors and PowerVia backside power delivery. Joint customers will be able to accelerate their SoC project schedules on process nodes from Intel 18A and beyond while optimizing for performance, power, area, bandwidth and latency for demanding AI, HPC and premium mobile applications.
英特爾代工服務（IFS）和Cadence Design Systems, Inc.（納斯達克股票代碼：CDNS）宣佈，他們已擴大合作伙伴關係，並簽訂了一項爲期多年的戰略協議，共同爲英特爾18A技術開發關鍵定製IP、優化設計流程和技術組合，該技術採用RibbonFET全能晶體管和PowerVia背面供電。共同客戶將能夠在英特爾 18A 及更高版本的流程節點上加快其 SoC 項目進度，同時針對要求苛刻的人工智能、高性能計算和高級移動應用程序優化性能、功耗、面積、帶寬和延遲。
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"We furthered our partnership with Intel Foundry Services through a significant strategic multiyear agreement to provide design software and leading IP at multiple Intel advanced nodes, thereby advancing Intel's IDM 2.0 strategy and accelerating mutual customer success," said Anirudh Devgan, president and chief executive officer at Cadence.
Cadence總裁兼首席執行官Anirudh Devgan表示：“我們通過一項爲期多年的重要戰略協議，進一步加強了與英特爾代工服務的合作伙伴關係，該協議旨在爲多個英特爾高級節點提供設計軟件和領先的IP，從而推進英特爾的IDM 2.0戰略，加速共同客戶的成功。”
"We're very excited to expand our partnership with Cadence to grow the IP ecosystem for IFS and provide choice for customers," said Stuart Pann, Intel senior vice president and general manager of IFS. "We will leverage Cadence's world-class portfolio of leading IP and advanced design solutions to enable our customers to deliver high-volume, high-performance and power-efficient SoCs on Intel's leading-edge process technologies."
英特爾高級副總裁兼IFS總經理斯圖爾特·潘恩表示：“我們很高興能夠擴大與Cadence的合作伙伴關係，以發展IFS的知識產權生態系統，爲客戶提供選擇。“我們將利用Cadence世界一流的領先IP和高級設計解決方案組合，使我們的客戶能夠在英特爾領先的工藝技術上交付大容量、高性能和高能效的SoC。”
Fast-growing market segments, such as AI/ML, HPC and premium mobile computing, require the latest standards in IP to take advantage of advanced packaging and silicon process technologies. Cadence's leading-edge implementations of trailblazing standards, such as advanced memory protocols, PCI Express, UCI Express and others for these key segments, enable joint customers to achieve scalable, high-performance designs that accelerate their time to market in IFS' most advanced silicon technologies and 3D-IC packaging capabilities.
快速增長的細分市場，如人工智能/機器學習、高性能計算和高端移動計算，需要最新的知識產權標準才能利用先進的封裝和硅工藝技術。Cadence對這些關鍵細分市場的開拓性標準（例如高級存儲器協議、PCI Express、UCI Express和其他標準）的領先實施使共同客戶能夠實現可擴展的高性能設計，從而加快其採用IFS最先進的硅技術和3D-IC封裝能力的上市時間。
Building a world-class foundry business is key to Intel's IDM 2.0 strategy, and this agreement strengthens IFS' offerings by making an additional portfolio of essential design tools, flows and interface IP available for foundry customers. It builds on Intel's engagement with other industry-leading IP providers as it continues to grow the IP ecosystem for IFS customers.
建立世界一流的代工業務是英特爾IDM 2.0戰略的關鍵，該協議通過向代工客戶提供額外的基本設計工具、流程和接口IP組合，加強了IFS的產品組合。它建立在英特爾與其他行業領先的知識產權提供商合作的基礎上，繼續爲IFS客戶發展知識產權生態系統。