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德龙激光(688170.SH):公司集成电路先进封装应用现有玻璃通孔等激光精细微加工设备,目前相关产品有少量出货

Delong Laser (688170.SH): The company's advanced integrated circuit packaging applications currently have laser fine microprocessing equipment such as glass holes. Currently, a small number of related products have been shipped

Gelonghui Finance ·  Dec 13, 2023 03:07

Gelonghui, December 13|Delong Laser (688170.SH) said on an interactive platform that the company's advanced integrated circuit packaging applications currently use laser fine processing equipment such as glass through-holes (TGV), laser grooving (low-k), wafer marking, module drilling (TMV), laser debonding, and auxiliary welding. Currently, a small number of related products are shipped, accounting for relatively low revenue.

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