share_log

晶方科技(603005.SH)：目前同时拥有8英寸和12英寸TSV封装能力

Jingfang Technology (603005.SH): Currently has both 8-inch and 12-inch TSV packaging capabilities

Gelonghui Finance ·  Dec 7, 2023 03:23

Gelonghui, December 7, Jingfang Technology (603005.SH) stated on the investor interactive platform that TSV- Through Silicon Via technology is a standard process in semiconductor processing, and it has a history of decades since wafers had dry silicon etching (DRIE deep reaction ion etching) technology. With the emergence of advanced packaging technology, it has been more than ten years since this technology was successfully applied internationally to wafer packaging. Among them, Jingfang Technology entered the field of advanced TSV packaging technology as early as 2005. After years of development, the company has significant leading advantages in technology, technology, market and intellectual property rights in this field. Currently, it also has 8-inch and 12-inch TSV packaging capabilities. It has been commercialized on a large scale in CIS, MEMS, radio frequency and other market applications, and has continuously expanded new application fields, and established a global manufacturing, R&D base and intellectual property system.

Disclaimer: This content is for informational and educational purposes only and does not constitute a recommendation or endorsement of any specific investment or investment strategy. Read more
    Write a comment