Gelonghui, November 16: Some investors asked Yan Dongwei (688172.SH) on the investor interactive platform, “Your company's strategic core is to continuously strengthen its wafer manufacturing capabilities and technological innovation capabilities. Can you introduce your company's wafer manufacturing process? Also, how many 6-inch and 8-inch wafers are produced annually at this stage? What is the current production capacity of the 12-inch wire”
The company said that the company's 6-inch wafer production line has built process platforms such as planar MOS, planar IGBT, BJT, TVS, JFET, SBD, FRD, analog IC, etc., and the 8-inch wafer production line has manufacturing capacity covering 90nm and above. It has built trench MOSFET, planar MOSFET, trench IGBT, CMOS, BCD, MEMS and other process platforms. It is developing process platforms such as silicon-based optoelectronics, infrared sensors, and RFCMOS. The production capacity of 6-inch wafers has reached 65,000 wafers per month, 8-inch wafers have reached 50,000 wafers per month, trial production of 12-inch wafers has been achieved, and the planned production capacity is 40,000 wafers per month.