Gelonghui October 11?Canqin Technology (688182.SH) said that with the arrival of the era of the Internet of everything, the whole electronic system has put forward higher requirements for circuit size, density, functionality, reliability and power. In recent years, HTCC (high temperature co-fired multilayer ceramics) components and components can meet the circuit requirements of the whole electronic system in terms of size, cost, function, reliability and so on. The HTCC electronic ceramic products to be produced by the company's fund-raising investment project will be mainly used in various application scenarios of high-reliability semiconductors, national defense science and industry, as well as high-frequency communication mobile terminals, including automotive electronics, computers, telemedicine, smart home, high-frequency communications and so on.

5G communication puts forward the technological development requirements of miniaturization, lightweight, low cost and high performance for terminal electronic components. The development of high-performance HTCC electronic ceramic products will become an urgent need in the era of 5G and the Internet of everything. Electronic ceramic components, ceramic packaging, ceramic substrates and other products based on HTCC technology can not only achieve the high performance required by 5G and IoE, but also have large-scale mass production potential and high environmental tolerance, which makes it possible to design flexible 5G and IoE communication terminals.

In the field of HTCC, domestic manufacturers start relatively late, and the accumulation of technology is relatively slow, resulting in a growing gap between the HTCC industry and foreign enterprises. With the increasing demand for HTCC components, ceramic packaging and high-power ceramic substrates in the high-end market, domestic manufacturers have begun to realize the importance and huge development space of HTCC technology. In addition, affected by international trade frictions, there is a huge market space for domestic substitution of HTCC products. Due to the high technical threshold of the HTCC industry, only a small number of domestic manufacturers are beginning to develop HTCC technology, and there are even fewer enterprises that form batch supply capacity. At present, the technical capacity and output level are far from meeting the development needs of domestic related fields.

In the future, with the development of markets such as 5G applications and the Internet of everything, the demand for HTCC electronic ceramic products will further increase. Domestic enterprises need to further improve their technological level and technical capabilities, and improve the competitiveness of their products. The breakthrough of the core technology of the target products will help to realize the import substitution of China's HTCC electronic ceramic products, promote the rapid and healthy development of the upstream and downstream of the communication industry, and enhance China's international competitiveness in related fields.

Since its inception, the company has been deeply engaged in the R & D and production of electronic ceramic materials and RF device technology, has long-term technical accumulation in the preparation process of electronic ceramic materials, and has stored the material formula, printing, metallization, co-firing, testing and other related technology needed for HTCC products, so it has technical realizability, and part of the production equipment is also universal. At the same time, the company has accumulated a large number of high-quality customer resources, many of the company's current customers are using HTCC electronic ceramic products, so the company's HTCC electronic ceramic products are easy to obtain the corresponding market resources and customer resources, at the same time, it will help to further open up new customers in new energy, semiconductors and other fields.

At present, the company already has part of the core technology and customer resources needed to produce HTCC electronic ceramic products, and the risk of entering the HTCC market is low. The company will continuously improve the manufacturing process and technology according to the market demand, and further increase the research in the field of HTCC technology.

Send investment, and strive to achieve the rapid maturity of the process, the core index level of products to reach and surpass domestic and foreign competitors. Up to now, the company's HTCC-related product line is gradually rich, a variety of ceramic substrates, shells and other products in semiconductors, new energy, wireless communications and other areas of customers began to send samples, and made phased progress. Thank you.