On July 25, the Bank of Shanghai (601229.SH) announced that with the approval of the People's Bank of China, the company issued the “Bank of Shanghai Co., Ltd. 2023 Second Financial Bonds” (hereinafter referred to as “current bonds”) in the national interbank bond market and completed the registration and custody of the bonds with Interbank Market Clearing House Co., Ltd.
The current bond was bookmarked and filed on July 20, 2023, and issuance was completed on July 24, 2023. The issuance scale of current bonds is RMB 9 billion. They are a 3-year fixed interest rate type with a coupon interest rate of 2.62%.
The funds raised by this bond will be used to meet the company's balance and liability allocation needs, enrich funding sources, optimize debt term structure, and promote steady business development in accordance with applicable laws and regulatory approvals.