On July 19th, the Bank of Shanghai (601229.SH) announced that, with the approval of the people's Bank of China, the company issued the "Shanghai Bank Co., Ltd. 2023 Special Financial Bond for small Micro Enterprise loan" (hereinafter referred to as the "current bond") in the national interbank bond market, and completed the registration and custody of the bonds in the interbank market clearing house Co., Ltd. The current issue was recorded on July 14, 2023 and completed on July 18, 2023. The current bond issue is RMB 10 billion yuan, with a fixed interest rate of three years and a coupon rate of 2.63%.
In accordance with the applicable laws and the approval of the regulatory authorities, the funds raised in the current issue of bonds will be specially used to issue loans for small micro-enterprises, increase credit support for small-scale micro-enterprises, and promote the sound and healthy development of small and micro-enterprise business.