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长电科技(600584.SH):推出的XDFOI高性能封装技术平台可以支持HBM的封装要求

Changdian Technology (600584.SH): The XDFOI high-performance packaging technology platform launched can support HBM's packaging requirements

Gelonghui Finance ·  Apr 30 05:26

Gelonghui, April 30丨Changdian Technology (600584.SH) said on the investor interactive platform that the XDFOI high-performance packaging technology platform launched by the company can support HBM's packaging requirements.

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