Revasum (ASX: RVS) Announces a 20%+ Increase in the Productivity of Their Flagship CMP Product for Silicon Carbide Wafer Manufacturing, the 6EZ, Achieved by Implementing Improvements to the Wafer Handling Control Software
Revasum (ASX: RVS) Announces a 20%+ Increase in the Productivity of Their Flagship CMP Product for Silicon Carbide Wafer Manufacturing, the 6EZ, Achieved by Implementing Improvements to the Wafer Handling Control Software
SAN LUIS OBISPO, Calif., July 12, 2023 /PRNewswire/ -- Revasum today announced the release of improvements to the system control software for their flagship silicon carbide CMP tool, 6EZ, which increase the throughput of the system by up to 20%+. The throughput improvements are included in our latest SW release 3.1 and include a number of improvements in the 6EZ wafer handling control software. The upgrade has been successfully deployed on existing 6EZ production systems at the factories of multiple Tier 1 customers. This software significantly reduces the 6EZ's cost of ownership per wafer for our customers.
加利福尼亞州聖路易斯奧比斯波，2023年7月12日/美通社/--Revasum今天宣佈，為其旗艦碳化矽化學機械拋光工具6EZ發佈了系統控制軟體的改進，將系統的產量提高了20%以上。我們最新的軟體版本3.1中包含了對吞吐量的改進，幷包括了對6EZ晶片處理控制軟體的多項改進。升級已在多個Tier 1客戶的工廠的現有6EZ生產系統上成功部署。該軟體為我們的客戶顯著降低了6EZ的每片晶圓擁有成本。
'The wafer handling control software in previous 6EZ software releases included wafer handling moves that were optimized for some early SiC polishing recipes but were imposing unnecessary constraints for the production recipes that are currently implemented by our customers. By removing these constraints, and implementing other wafer handling improvements, we were able to significantly increase the throughput of the tool without any detrimental impact on tool reliability. We have also ensured that these improvements would not change the excellent process results from the production recipes currently being used by our customers.' Said Bill Kalenian, Vice President of Engineering at Revasum.
以前的6EZ軟體版本中的晶片處理控制軟件包括晶片處理移動，這些移動針對一些早期的碳化矽拋光配方進行了優化，但對我們客戶目前實施的生產配方施加了不必要的限制。通過消除這些限制，並實施其他晶片處理改進，我們能夠顯著提高工具的生產能力，而不會對工具的可靠性產生任何不利影響。我們還確保這些改進不會改變我們客戶目前使用的生產配方的優秀工藝結果。說比爾·卡列尼安，Revasum公司工程部副主任總裁。
Revasum (ASX:RVS) Announces a 20%+ increase in productivity of their flagship CMP product for #SiC wafer manufacturing
Revasum(澳大利亞證券交易所股票代碼：RVS)宣佈，其旗艦產品#碳化矽晶圓製造的生產率提高了20%以上
'Since achieving our initial goals of demonstrating reliable high-volume operations and repeatable, high-quality polishing results on hard SiC substrates, it was right time for Revasum to enable higher productivity for our customers as they ramp to higher wafer volumes. SW 3.1 enables a significant increase in productivity, and has a number of other new features that will improve the flexibility and reliability of the 6EZ in high volume production,' said Scott Jewler, Revasum CEO. 'Software version 3.1 has been installed and released to production at multiple leading SiC substrate customers and will ship installed on future orders.'
“既然我們實現了在硬質碳化矽襯底上展示可靠的大批量操作和可重複的高質量拋光效果的最初目標，那麼現在正是Revasum為我們的客戶實現更高生產率的時候了，因為他們正在向更大的晶片產量傾斜。SW3.1實現了生產率的顯著提高，並擁有許多其他新功能，將提高6EZ在大批量生產中的靈活性和可靠性。”斯科特·朱勒，Revasum首席執行官。軟體3.1版已經在多家領先的碳化矽基板客戶安裝並投產，並將在未來的訂單中安裝發貨。
About Revasum, Inc.:
Revasum specializes in the design and manufacturing of grinding and polishing equipment for semiconductor manufacturing. Revasum has leveraged its significant intellectual property portfolio to develop two flagship products designed from the ground up for silicon carbide. The new products are configurable for SiC wafer sizes up to 200mm.
Revasum公司簡介：
Revasum專門從事半導體制造的研磨和拋光設備的設計和製造。Revasum利用其重要的知識產權組合開發了兩款全新設計的碳化矽旗艦產品。新產品可配置為最大尺寸為200 mm的碳化矽晶片。
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