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6-K: Report of foreign private issuer [Rules 13a-16 and 15d-16]

6-K: Report of foreign private issuer [Rules 13a-16 and 15d-16]

6-K:外國發行人報告
美股sec公告 ·  04/25 06:08
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Taiwan Semiconductor Manufacturing Company Ltd. (TSMC), listed on the NYSE as TSM, has filed a Form 6-K with the United States Securities and Exchange Commission for the month of April 2024. The report, signed by Senior Vice President and Chief Financial Officer Wendell Huang on April 25, 2024, details several key updates regarding the company's shareholdings and financial activities for March 2024. Notably, there were minor changes in the shareholdings of TSMC's board of directors and executive officers, with Chairman Mark Liu's shares increasing by 415, while Senior Vice President Wei-Jen Lo's shares decreased by 45,000. Vice President and Chief Information Officer Chris Horng-Dar Lin's shareholdings increased by 2,000. No changes in the pledge of TSMC common shares were reported. TSMC and its subsidiaries made a significant fixed-income investment of NT$20.0 billion. Additionally, TSMC issued unsecured bonds totaling NT$22.8 billion, with varying maturities and a coupon rate of 1.64%, to be repaid annually.
Taiwan Semiconductor Manufacturing Company Ltd. (TSMC), listed on the NYSE as TSM, has filed a Form 6-K with the United States Securities and Exchange Commission for the month of April 2024. The report, signed by Senior Vice President and Chief Financial Officer Wendell Huang on April 25, 2024, details several key updates regarding the company's shareholdings and financial activities for March 2024. Notably, there were minor changes in the shareholdings of TSMC's board of directors and executive officers, with Chairman Mark Liu's shares increasing by 415, while Senior Vice President Wei-Jen Lo's shares decreased by 45,000. Vice President and Chief Information Officer Chris Horng-Dar Lin's shareholdings increased by 2,000. No changes in the pledge of TSMC common shares were reported. TSMC and its subsidiaries made a significant fixed-income investment of NT$20.0 billion. Additionally, TSMC issued unsecured bonds totaling NT$22.8 billion, with varying maturities and a coupon rate of 1.64%, to be repaid annually.
在紐約證券交易所上市的名爲TSM的臺灣半導體制造股份有限公司(TSMC)已向美國證券交易委員會提交了2024年4月的6-K表格。該報告由高級副總裁兼首席財務官黃文德於2024年4月25日簽署,詳細介紹了有關公司2024年3月股權和財務活動的幾項重要更新。值得注意的是,台積電董事會和執行官的持股量略有變化,董事長馬克·劉的股價增加了415股,而高級副總裁羅維仁的股價減少了45,000股。副總裁兼首席信息官克里斯·霍恩-達爾·林的持股量增加了2,000股。據報道,台積電普通股的質押沒有變化。台積電及其子公司進行了200億新臺幣的大量固定收益投資。此外,台積電發行了總額爲新臺幣228億元的無抵押債券,期限各不相同,票面利率爲1.64%,每年償還。
在紐約證券交易所上市的名爲TSM的臺灣半導體制造股份有限公司(TSMC)已向美國證券交易委員會提交了2024年4月的6-K表格。該報告由高級副總裁兼首席財務官黃文德於2024年4月25日簽署,詳細介紹了有關公司2024年3月股權和財務活動的幾項重要更新。值得注意的是,台積電董事會和執行官的持股量略有變化,董事長馬克·劉的股價增加了415股,而高級副總裁羅維仁的股價減少了45,000股。副總裁兼首席信息官克里斯·霍恩-達爾·林的持股量增加了2,000股。據報道,台積電普通股的質押沒有變化。台積電及其子公司進行了200億新臺幣的大量固定收益投資。此外,台積電發行了總額爲新臺幣228億元的無抵押債券,期限各不相同,票面利率爲1.64%,每年償還。
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