Cadence And TSMC Collaborate On Wide-Ranging Innovations To Transform System And Semiconductor Design
Cadence And TSMC Collaborate On Wide-Ranging Innovations To Transform System And Semiconductor Design
Cadence 和台積電合作進行廣泛的創新，以改變系統和半導體設計
Cadence's best-in-class Integrity 3D-IC platform supercharged with new features
Revolutionary AI-driven digital and custom/analog full flows and optimized for TSMC 2nm process technologies
Comprehensive IP portfolio for TSMC's advanced nodes, new solver certifications and key advancements in photonics enable next-generation semiconductor design innovations
Cadence 一流的 Integrity 3D-IC 平台增加了新功能
革命性的人工智能驅動的數字和定製/模擬全流程，並針對台積電 2nm 工藝技術進行了優化
台積電先進節點的全面 IP 組合、新的求解器認證和光子學的關鍵進步推動了下一代半導體設計創新
Cadence Design Systems, Inc. (NASDAQ:CDNS) and TSMC have extended their longstanding collaboration by announcing a broad range of innovative technology advancements to accelerate design, including developments ranging from 3D-IC and advanced process nodes to design IP and photonics. This collaboration significantly advances system and semiconductor design for AI, automotive, aerospace...
Cadence Design Systems, Inc.（納斯達克股票代碼：CDNS）和台積電宣佈了廣...
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