Intel (NASDAQ:INTC) and Siemens (OTCPK:SIEGY) (OTCPK:SMAWF) are collaborating to advance semiconductor manufacturing production efficiency and sustainability across the value chain.
The companies signed a Memorandum of Understanding, or MoU, to partner on driving digitalization and sustainability of microelectronics manufacturing. The collaboration will explore initiatives, including optimizing energy management and addressing carbon footprints across the value chain.
"We are excited to build upon Intel’s advanced manufacturing capabilities by expanding our collaboration with Siemens to explore new areas where we can utilize Siemens’ portfolio of automation solutions to enhance efficiency and sustainability in semiconductor infrastructure, facilities, and factory operations," said Keyvan Esfarjani, Intel's executive vice president and chief global operations officer.
The companies noted that they will use their IoT solutions, along with Siemens automation solutions to enhance semiconductor manufacturing efficiency and sustainability.