Revasum (ASX: RVS) Announces a 20%+ Increase in the Productivity of Their Flagship CMP Product for Silicon Carbide Wafer Manufacturing, the 6EZ, Achieved by Implementing Improvements to the Wafer Handling Control Software
Revasum (ASX: RVS) Announces a 20%+ Increase in the Productivity of Their Flagship CMP Product for Silicon Carbide Wafer Manufacturing, the 6EZ, Achieved by Implementing Improvements to the Wafer Handling Control Software
SAN LUIS OBISPO, Calif., July 12, 2023 /PRNewswire/ -- Revasum today announced the release of improvements to the system control software for their flagship silicon carbide CMP tool, 6EZ, which increase the throughput of the system by up to 20%+. The throughput improvements are included in our latest SW release 3.1 and include a number of improvements in the 6EZ wafer handling control software. The upgrade has been successfully deployed on existing 6EZ production systems at the factories of multiple Tier 1 customers. This software significantly reduces the 6EZ's cost of ownership per wafer for our customers.
加利福尼亚州圣路易斯奥比斯波，2023年7月12日/美通社/--Revasum今天宣布，为其旗舰碳化硅化学机械抛光工具6EZ发布了系统控制软件的改进，将系统的产量提高了20%以上。我们最新的软件版本3.1中包含了对吞吐量的改进，并包括了对6EZ晶片处理控制软件的多项改进。升级已在多个Tier 1客户的工厂的现有6EZ生产系统上成功部署。该软件为我们的客户显著降低了6EZ的每片晶圆拥有成本。
'The wafer handling control software in previous 6EZ software releases included wafer handling moves that were optimized for some early SiC polishing recipes but were imposing unnecessary constraints for the production recipes that are currently implemented by our customers. By removing these constraints, and implementing other wafer handling improvements, we were able to significantly increase the throughput of the tool without any detrimental impact on tool reliability. We have also ensured that these improvements would not change the excellent process results from the production recipes currently being used by our customers.' Said Bill Kalenian, Vice President of Engineering at Revasum.
以前的6EZ软件版本中的晶片处理控制软件包括晶片处理移动，这些移动针对一些早期的碳化硅抛光配方进行了优化，但对我们客户目前实施的生产配方施加了不必要的限制。通过消除这些限制，并实施其他晶片处理改进，我们能够显著提高工具的生产能力，而不会对工具的可靠性产生任何不利影响。我们还确保这些改进不会改变我们客户目前使用的生产配方的优秀工艺结果。说比尔·卡列尼安，Revasum公司工程部副主任总裁。
Revasum (ASX:RVS) Announces a 20%+ increase in productivity of their flagship CMP product for #SiC wafer manufacturing
Revasum(澳大利亚证券交易所股票代码：RVS)宣布，其旗舰产品#碳化硅晶圆制造的生产率提高了20%以上
'Since achieving our initial goals of demonstrating reliable high-volume operations and repeatable, high-quality polishing results on hard SiC substrates, it was right time for Revasum to enable higher productivity for our customers as they ramp to higher wafer volumes. SW 3.1 enables a significant increase in productivity, and has a number of other new features that will improve the flexibility and reliability of the 6EZ in high volume production,' said Scott Jewler, Revasum CEO. 'Software version 3.1 has been installed and released to production at multiple leading SiC substrate customers and will ship installed on future orders.'
“既然我们实现了在硬质碳化硅衬底上展示可靠的大批量操作和可重复的高质量抛光效果的最初目标，那么现在正是Revasum为我们的客户实现更高生产率的时候了，因为他们正在向更大的晶片产量倾斜。SW3.1实现了生产率的显著提高，并拥有许多其他新功能，将提高6EZ在大批量生产中的灵活性和可靠性。”斯科特·朱勒，Revasum首席执行官。软件3.1版已经在多家领先的碳化硅基板客户安装并投产，并将在未来的订单中安装发货。
About Revasum, Inc.:
Revasum specializes in the design and manufacturing of grinding and polishing equipment for semiconductor manufacturing. Revasum has leveraged its significant intellectual property portfolio to develop two flagship products designed from the ground up for silicon carbide. The new products are configurable for SiC wafer sizes up to 200mm.
Revasum公司简介：
Revasum专门从事半导体制造的研磨和抛光设备的设计和制造。Revasum利用其重要的知识产权组合开发了两款全新设计的碳化硅旗舰产品。新产品可配置为最大尺寸为200 mm的碳化硅晶片。
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