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SemiLEDS To Be Issued U.S. Patent Titled 'Method For Fabricating (LED) Dice Using Laser Lift-Off From A Substrate To A Receiving Plate'

SemiLEDS To Be Issued U.S. Patent Titled 'Method For Fabricating (LED) Dice Using Laser Lift-Off From A Substrate To A Receiving Plate'

半导体发光二极管将获美国专利“使用激光从衬底到接收板的剥离制造(LED)芯片的方法”
Benzinga Real-time News ·  2022/08/15 12:20

SemiLEDS To Be Issued U.S. Patent Titled 'Method For Fabricating (LED) Dice Using Laser Lift-Off From A Substrate To A Receiving Plate'

半导体发光二极管将获美国专利“使用激光从衬底到接收板的剥离制造(LED)芯片的方法”

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