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6-K: Report of foreign private issuer [Rules 13a-16 and 15d-16]

6-K: Report of foreign private issuer [Rules 13a-16 and 15d-16]

6-K：外国发行人报告
美股sec公告 ·  04/25 06:08
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Taiwan Semiconductor Manufacturing Company Ltd. (TSMC), listed on the NYSE as TSM, has filed a Form 6-K with the United States Securities and Exchange Commission for the month of April 2024. The report, signed by Senior Vice President and Chief Financial Officer Wendell Huang on April 25, 2024, details several key updates regarding the company's shareholdings and financial activities for March 2024. Notably, there were minor changes in the shareholdings of TSMC's board of directors and executive officers, with Chairman Mark Liu's shares increasing by 415, while Senior Vice President Wei-Jen Lo's shares decreased by 45,000. Vice President and Chief Information Officer Chris Horng-Dar Lin's shareholdings increased by 2,000. No changes in the pledge of TSMC common shares were reported. TSMC and its subsidiaries made a significant fixed-income investment of NT$20.0 billion. Additionally, TSMC issued unsecured bonds totaling NT$22.8 billion, with varying maturities and a coupon rate of 1.64%, to be repaid annually.
Taiwan Semiconductor Manufacturing Company Ltd. (TSMC), listed on the NYSE as TSM, has filed a Form 6-K with the United States Securities and Exchange Commission for the month of April 2024. The report, signed by Senior Vice President and Chief Financial Officer Wendell Huang on April 25, 2024, details several key updates regarding the company's shareholdings and financial activities for March 2024. Notably, there were minor changes in the shareholdings of TSMC's board of directors and executive officers, with Chairman Mark Liu's shares increasing by 415, while Senior Vice President Wei-Jen Lo's shares decreased by 45,000. Vice President and Chief Information Officer Chris Horng-Dar Lin's shareholdings increased by 2,000. No changes in the pledge of TSMC common shares were reported. TSMC and its subsidiaries made a significant fixed-income investment of NT$20.0 billion. Additionally, TSMC issued unsecured bonds totaling NT$22.8 billion, with varying maturities and a coupon rate of 1.64%, to be repaid annually.
在纽约证券交易所上市的名为TSM的台湾半导体制造股份有限公司（TSMC）已向美国证券交易委员会提交了2024年4月的6-K表格。该报告由高级副总裁兼首席财务官黄文德于2024年4月25日签署，详细介绍了有关公司2024年3月股权和财务活动的几项重要更新。值得注意的是，台积电董事会和执行官的持股量略有变化，董事长马克·刘的股价增加了415股，而高级副总裁罗维仁的股价减少了45,000股。副总裁兼首席信息官克里斯·霍恩-达尔·林的持股量增加了2,000股。据报道，台积电普通股的质押没有变化。台积电及其子公司进行了200亿新台币的大量固定收益投资。此外，台积电发行了总额为新台币228亿元的无抵押债券，期限各不相同，票面利率为1.64％，每年偿还。
在纽约证券交易所上市的名为TSM的台湾半导体制造股份有限公司（TSMC）已向美国证券交易委员会提交了2024年4月的6-K表格。该报告由高级副总裁兼首席财务官黄文德于2024年4月25日签署，详细介绍了有关公司2024年3月股权和财务活动的几项重要更新。值得注意的是，台积电董事会和执行官的持股量略有变化，董事长马克·刘的股价增加了415股，而高级副总裁罗维仁的股价减少了45,000股。副总裁兼首席信息官克里斯·霍恩-达尔·林的持股量增加了2,000股。据报道，台积电普通股的质押没有变化。台积电及其子公司进行了200亿新台币的大量固定收益投资。此外，台积电发行了总额为新台币228亿元的无抵押债券，期限各不相同，票面利率为1.64％，每年偿还。
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