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Taiwan Semiconductor | 6-K: Arizona and U.S. Department of Commerce Announce up to US$6.6 Billion in Proposed CHIPS Act Direct Funding, the Company Plans Third Leading-Edge Fab in Phoenix

Taiwan Semiconductor | 6-K: Report of foreign private issuer [Rules 13a-16 and 15d-16]

台积电 | 6-K:外国发行人报告
SEC announcement ·  04/08 06:37
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Taiwan Semiconductor Manufacturing Company Ltd. (TSMC) has announced a partnership with the U.S. Department of Commerce, securing up to $6.6 billion in direct funding under the CHIPS and Science Act. This funding will support the construction of a third semiconductor fabrication plant (fab) in Phoenix, Arizona, as part of TSMC Arizona's expansion. The new fab will utilize the most advanced semiconductor process technology in the U.S. With the addition of the third fab, TSMC's total investment in the Arizona site will exceed $65 billion, marking the largest foreign direct investment in Arizona and in a U.S. greenfield project. TSMC's Chairman, Dr. Mark Liu, emphasized the opportunity to provide advanced manufacturing technologies in the U.S., while...Show More
Taiwan Semiconductor Manufacturing Company Ltd. (TSMC) has announced a partnership with the U.S. Department of Commerce, securing up to $6.6 billion in direct funding under the CHIPS and Science Act. This funding will support the construction of a third semiconductor fabrication plant (fab) in Phoenix, Arizona, as part of TSMC Arizona's expansion. The new fab will utilize the most advanced semiconductor process technology in the U.S. With the addition of the third fab, TSMC's total investment in the Arizona site will exceed $65 billion, marking the largest foreign direct investment in Arizona and in a U.S. greenfield project. TSMC's Chairman, Dr. Mark Liu, emphasized the opportunity to provide advanced manufacturing technologies in the U.S., while CEO Dr. C.C. Wei highlighted the company's commitment to meeting customer demand for advanced silicon. The expansion is expected to create approximately 6,000 direct high-tech jobs and support a competitive global semiconductor ecosystem. The first Arizona fab is set to begin production in the first half of 2025 with 4nm technology, followed by the second fab with 2nm and 3nm technologies in 2028, and the third fab by the end of the decade. TSMC is also focused on green manufacturing, aiming for a 90% water recycling rate and designing an industrial water reclamation plant for near zero liquid discharge. Additionally, TSMC plans to apply for U.S. Treasury Department Investment Tax Credits and may receive up to $5 billion in loans. The company maintains its long-term financial goals, including a 15-20% revenue CAGR, a gross margin of 53% or higher, and an ROE of 25% or higher. Customer remarks from AMD, Apple, and NVIDIA expressed strong support for TSMC's U.S. expansion.
台湾半导体制造有限公司(TSMC)宣布与美国商务部建立合作伙伴关系,根据CHIPS和科学法案获得高达66亿美元的直接资金。作为亚利桑那州台积电扩张的一部分,这笔资金将支持在亚利桑那州凤凰城建造第三座半导体制造工厂(fab)。新晶圆厂将采用美国最先进的半导体工艺技术。随着第三座晶圆厂的加入,台积电在亚利桑那州基地的总投资将超过650亿美元,这是在亚利桑那州和美国新建项目中最大的外国直接投资。台积电董事长Mark Liu博士强调了在美国提供先进制造技术的机会,而首席执行官C.C. Wei博士则强调了该公司对满足客户对先进硅需求的承诺。此次扩张预计将创造约6,000个直接的高科技工作岗位,并支持竞争...展开全部
台湾半导体制造有限公司(TSMC)宣布与美国商务部建立合作伙伴关系,根据CHIPS和科学法案获得高达66亿美元的直接资金。作为亚利桑那州台积电扩张的一部分,这笔资金将支持在亚利桑那州凤凰城建造第三座半导体制造工厂(fab)。新晶圆厂将采用美国最先进的半导体工艺技术。随着第三座晶圆厂的加入,台积电在亚利桑那州基地的总投资将超过650亿美元,这是在亚利桑那州和美国新建项目中最大的外国直接投资。台积电董事长Mark Liu博士强调了在美国提供先进制造技术的机会,而首席执行官C.C. Wei博士则强调了该公司对满足客户对先进硅需求的承诺。此次扩张预计将创造约6,000个直接的高科技工作岗位,并支持竞争激烈的全球半导体生态系统。亚利桑那州的第一座晶圆厂定于2025年上半年开始生产,采用4纳米技术,其次是2028年第二座采用2纳米和3纳米技术的晶圆厂,第三座晶圆厂将在本世纪末开始生产。台积电还专注于绿色制造,目标是将水回收率提高到90%,并设计了接近零的液体排放的工业用水回收厂。此外,台积电计划申请美国财政部投资税收抵免,并可能获得高达50亿美元的贷款。该公司维持其长期财务目标,包括收入复合年增长率为15-20%,毛利率为53%或以上,投资回报率为25%或以上。AMD、苹果和英伟达的客户言论表示坚决支持台积电在美国的扩张。
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