Icheon, South Korea, May 2 (Reuters) - South Korea's SK Hynix 000660.ks Said on Thursday Its High-Bandwidth Memory (Hbm) Chips Used in AI Chipsets Are Almost Sold Out for 2025, After Their 2024 Chips Were Fully Booked.
韓國利川5月2日電（路透社）——韓國SK海力士 000660.ks 週四表示，其用於人工智能芯片組的高帶寬內存（Hbm）芯片在2024年芯片已全部預訂後，到2025年幾乎售罄。
Chief Executive Officer Kwak Noh-Jung Said the Nvidia Supplier and the World's Second-Largest Memory Chipmaker Will Begin Sending Samples of the Latest Version of Hbm Chips, Called 12-Layer Hbm3E, in May and Begin Mass Producing Them in the Third-Quarter.
首席執行官Kwak Noh-Jung表示，Nvidia供應商和全球第二大存儲芯片製造商將在5月開始發送名爲12層Hbm3E的最新版本的Hbm芯片樣品，並在第三季度開始批量生產。
Kwak Said Its Hbm Products This Year Had Already Sold Out, While 2025 Hbm Volumes Were Almost Sold Out Amid a Rapid Expansion of AI Technology Into a Wider Range of on-Device Applications Such as Smartphones, Pcs, and Automobiles.
Kwak表示，其Hbm產品今年的Hbm產品已經售罄，而在人工智能技術迅速擴展到智能手機、個人電腦和汽車等更廣泛的設備端應用的情況下，2025年的Hbm銷量幾乎售罄。
(Reporting by Joyce Lee and Heekyong Yang
Editing by Ed Davies)
（Joyce Lee 和 Heekyong Yang Yang 報道）
由 Ed Davies 編輯）